公开(公告)号：KR1020130047302A

公开(公告)日：2013-05-08

申请号：KR1020110112238

申请日：2011-10-31

Applicant: 한국기계연구원

Inventor： 이동근 ,  이용태 ,  김태원 ,  하헌초

IPC: C23C14/35

Abstract: PURPOSE: A high efficiency sputtering apparatus is provided to prevent the corrosion of a magnet with a cover in order to make the intensity and distribution of a magnetic field uniform, thereby improving deposition efficiency with preventing the property variation of a deposited thin film. CONSTITUTION: A high efficiency sputtering apparatus includes a housing(210), a hollow cylinder type sputtering target(220), and a magnet unit(230). The housing at a cathode electrode inside a vacuum chamber is rotated by a power source. The magnet unit comprises a backing plate(233), a magnet(232), and a cover(231). The magnet unit is installed at the periphery of a coolant feeding pipe at the inner center of the housing. The magnet is coupled to one side of the backing plate, and the cover covers the outer surface of the magnet. The sputtering target is formed to have a distance from the magnet unit. [Reference numerals] (AA) Discharge of cooling water; (BB) Intake of cooling water

Abstract translation: 目的：提供一种高效率的溅射装置，以防止具有盖的磁体的腐蚀，以使得磁场的强度和分布均匀，从而提高沉积效率，同时防止沉积的薄膜的性质变化。 构成：高效率溅射装置包括壳体（210），中空圆筒型溅射靶（220）和磁体单元（230）。 真空室内的阴极电极的壳体由电源旋转。 磁体单元包括背板（233），磁体（232）和盖（231）。 磁体单元安装在壳体内部中心处的冷却剂供给管的周边。 磁体与背板的一侧相连，盖覆盖磁体的外表面。 溅射靶形成为具有距离磁体单元的距离。 （附图标记）（AA）冷却水的排出; （BB）进水冷却水