公开(公告)号：KR1020120019634A

公开(公告)日：2012-03-07

申请号：KR1020100082941

申请日：2010-08-26

Applicant: 한국전자통신연구원

Inventor： 권종화 ,  나완수 ,  김병기

IPC: H05K9/00 ,  H05K1/02 ,  H01P1/20 ,  H01Q15/00

Abstract: PURPOSE: An electromagnetic bandgap structure is provided to increase a frequency noise reduction band by using a transmission line and a via connected to a patch. CONSTITUTION: An EBG(Electromagnetic Band Gap) structure is comprised of patches(300) which are regularly arranged and one ground surface without an air gap. The patches are connected through a signal line(301) and a via(303). An anti-pad is additionally formed in a ground layer to prevent a short. A gap(302) is formed between patches. A PCB is comprised of an uppermost layer, a power layer, a ground layer, and a lowermost layer.

Abstract translation: 目的：提供电磁带隙结构，通过使用连接到贴片的传输线和通孔来增加频率降噪带。 构成：EBG（电磁带隙）结构由经常布置的贴片（300）和一个没有气隙的地面构成。 贴片通过信号线（301）和通孔（303）连接。 另外在接地层中形成防焊垫以防止短路。 在贴片之间形成间隙（302）。 PCB由最上层，功率层，接地层和最下层组成。