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公开(公告)号:KR1019940007667B1
公开(公告)日:1994-08-22
申请号:KR1019910022927
申请日:1991-12-13
Applicant: 한국전자통신연구원
IPC: H01L29/78
Abstract: The method manufactures a GaAs recessed gate field effect transistor. The method comprises the steps of: (A) injecting n-type impurity on a channel layer and a source and drain region of a GaAs substrate (1); (B) covering a substrate by a dielectric layer (2) and activating by thermal process; (C) masking a photosensitive layer on a dielectric layer (2) and etching a layer (2) to form a gate region; (D) forming an oxide layer (4) of a certain thickness on a substrate; and (E) etching an oxide layer (4), vaporizing a gate metal (5) and forming an ohmic electrode (6).
Abstract translation: 该方法制造了GaAs凹陷栅极场效应晶体管。 该方法包括以下步骤:(A)在GaAs衬底(1)的沟道层和源极和漏极区域上注入n型杂质; (B)通过电介质层(2)覆盖衬底并通过热处理激活; (C)掩蔽介电层(2)上的感光层并蚀刻层(2)以形成栅极区域; (D)在衬底上形成一定厚度的氧化物层(4); 和(E)蚀刻氧化物层(4),蒸发栅极金属(5)并形成欧姆电极(6)。
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