산화물 반도체막의 형성 방법
    1.
    发明公开
    산화물 반도체막의 형성 방법 审中-实审
    形成氧化物半导体膜的方法

    公开(公告)号:KR1020140068536A

    公开(公告)日:2014-06-09

    申请号:KR1020120136144

    申请日:2012-11-28

    CPC classification number: H01L21/02554 H01L21/02565 H01L21/02623 H01L21/324

    Abstract: A method of forming an oxide semiconductor is provided. The method comprises a step of coating a substrate with an oxide semiconductor solution; a step of providing the substrate to an oxygen atom-containing gas atmosphere; and a step of forming the oxide semiconductor solution into an oxide semiconductor film by conducting a thermal treatment process at 300°C or less.

    Abstract translation: 提供一种形成氧化物半导体的方法。 该方法包括用氧化物半导体溶液涂覆衬底的步骤; 将基板提供到含氧原子的气体气氛的步骤; 以及通过在300℃以下的热处理工序将氧化物半导体溶液形成氧化物半导体膜的工序。

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