公开(公告)号：KR101343912B1

公开(公告)日：2013-12-20

申请号：KR1020130119199

申请日：2013-10-07

Applicant: 한국항공우주연구원

Inventor： 이주훈 ,  장태성 ,  서정기

IPC: H05K5/02 ,  H05K9/00

Abstract: The present invention relates to an electronic equipment housing for space which uses a lightweight composite material. The electronic equipment housing comprises: a grid-stiffened frame (11) which is formed by combining a frame skin (14), multiple grids (15), and bosses (16); lugs (12) and lug supports (17) which are bonded or combined with one side of the grid-stiffened frame (11); a PCB guide rail (13) which guides and installs multiple electronic circuit boards (40) by being attached or combined with the grid-stiffened frame (11); and a housing front cover (20) and a housing rear cover (30) that form the closed structure of the electronic equipment housing, wherein at least one among the grid-stiffened frame (11), the housing front cover (20), and the housing rear cover (30) is manufactured by laminating a lightweight carbon fiber-reinforced plastic (CFRP) material as a main material, and the grid-stiffened frame (11) has a monolithic structure without mechanical assembly or joints.

Abstract translation: 本发明涉及一种使用轻质复合材料的空间电子设备外壳。 电子设备壳体包括：通过组合框架皮肤（14），多个网格（15）和凸台（16）而形成的网格加强框架（11）。 凸耳（12）和凸耳支撑件（17），其与网格加强的框架（11）的一侧结合或组合; PCB导轨（13），其通过与网格加强的框架（11）附接或组合来引导和安装多个电子电路板（40）; 以及形成电子设备壳体的封闭结构的壳体前盖（20）和壳体后盖（30），其中，格栅加强框架（11），壳体前盖（20）和 通过层叠轻质碳纤维增强塑料（CFRP）材料作为主要材料制造壳体后盖（30），并且格栅加强框架（11）具有没有机械组装或接头的整体结构。