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公开(公告)号:KR100688912B1
公开(公告)日:2007-03-02
申请号:KR1020050087241
申请日:2005-09-20
Applicant: 한국화학연구원
IPC: C08G73/06 , C07D401/04 , C08G73/02 , C08G73/08
Abstract: Provided is a hyper-branched polyimide, which exhibits an excellent glass transition temperature, thermal stability and gas permeability, and is useful for producing highly heat resistant films for electric and electronic materials, liquid crystal aligning layers, semiconductor components, molding components and adhesives. The hyper-branched polyimide has a structure of an amine-terminated polyimide represented by a formula 1 or an anydride-terminated polyimide represented by a formula 2, and weight average molecular weight of 6,000-20,000. In the formulae 1 and 2, X represents a repeating unit represented by formulae 3 and 4, wherein Xn represents a hyper-branch having n X groups linked radially to each other, and n is an integer of 8-41.
Abstract translation: 本发明提供显示出优异的玻璃化转变温度,热稳定性和气体渗透性的超支化聚酰亚胺,并且用于制造用于电气和电子材料,液晶取向层,半导体组件,成型组件和粘合剂的高耐热性膜。 超支化聚酰亚胺具有由式1表示的胺封端的聚酰亚胺或由式2表示的末端终端聚酰亚胺的结构,并且重均分子量为6,000-20,000。 在式1和式2中,X表示由式3和4表示的重复单元,其中Xn表示具有彼此径向连接的n个X基团的超支,并且n是8-41的整数。