Abstract:
This relates to a manufacturing method of new polyimide copolymer which has the reccuring unit (3). Polyimide copolymer is prepared by thermocyclization of polyamidic acid ester at 50-400deg.C, which is made from diamine compd. of (1) and aromatic dianhydride of (2). The above diamine compd. is prepared from the aromatic acid ester, which is prepared by reaction pyromelitic dianhydride or benzophenone tetracarboxylic dianhydride with ethanol.
Abstract:
본 발명은 방향족 폴리이미드가 갖는 우수한 내열성을 유지하면서 단량체로 사용되는 두종류의 방향족 유기산 이무수물과 방향족 디아민을 규칙적으로 배열하여 각 단량체들의 특성을 조화시키는 방법으로 우수한 가공성 및 기계적 물성을 갖는 공중합체 및 그 제조방법에 관한 것이다. 본 발명에 의한 폴리이미드 공중합체는 유기용매중에서 일반식(I)
Abstract:
This relates to polyamidic ester consisting of reccuring unit of formula (6). Numeric viscosity of this polyamidic ester is 0.1-3.0dl/g at 30deg.C. Polyimide copolymer with reccuring unit (3) is prepared by thermocyclization of polyamidic acid ester composed of aromatic acid dianhydride and diamine compd.. The above diamine compd. is prepared from the aromatic acid ester, which is prepared by reaction pyromelitic dianhydride or benzophenone tetracarboxylic dianhydride with ethanol.
Abstract:
The diamine compound of formula(I) is produced by acylation reacting an aromatic acid ester of formula(II) in the organic solvent to obtain an acyl chloride compound, reacting the acyl chloride compound with a diamine of NH2-R1-NH2 or a nitroamine of NH2-R1-NO2, and hydrogenation reacting the reactant. In the formulas, R1 and R2 are each monocyclic aromatic gp. or non-condensation multicyclic aromatic gp. The polyimide copolymer having a good heat resistance is produced by reacting the diamine compound of formula(I) with an aromatic organic dianhydride in the organic solvent i. e. N, N-dimethyl acetamide, N, N-dimethyl formamide and/or N-methyl-2-pyrrolidone, and cyclization reacting the produced polyamide acid ester.
Abstract:
PURPOSE: A novel compound containing a bis diacetylene group, an organic thin film using the compound and its preparation method are provided, to improve the uniformity of thickness and the heat stability of an organic thin film. CONSTITUTION: The compound containing a bis diacetylene group is represented by the formula 1, wherein R1 is H or a linear or branched alkyl group of C1-C12; and R2 is a single bond directly bonded to R or -Ph-, -Ph-C(=O)O- or -Ph-O-C(=O)-. The organic thin film is prepared by evaporation depositing the compound of the formula 1 on a substrate in vacuum and irradiating a UV ray to the deposited one. Preferably the pattern is formed on the organic thin film by using a mask in the irradiation of a UV ray.
Abstract:
PURPOSE: A novel compound containing a bis diacetylene group, an organic thin film using the compound and its preparation method are provided, to improve the uniformity of thickness and the heat stability of an organic thin film. CONSTITUTION: The compound containing a bis diacetylene group is represented by the formula 1, wherein R1 is H or a linear or branched alkyl group of C1-C12; and R2 is a single bond directly bonded to R or -Ph-, -Ph-C(=O)O- or -Ph-O-C(=O)-. The organic thin film is prepared by evaporation depositing the compound of the formula 1 on a substrate in vacuum and irradiating a UV ray to the deposited one. Preferably the pattern is formed on the organic thin film by using a mask in the irradiation of a UV ray.