公开(公告)号：KR1020030018859A

公开(公告)日：2003-03-06

申请号：KR1020010053443

申请日：2001-08-31

Applicant: 한학수

Inventor： 한학수 ,  이춘근 ,  민경옥 ,  이충봉

IPC: C08G73/14

Abstract: PURPOSE: A novel polyamideimide resin using an aromatic dicarboxylic acid, its preparation method and a highly heat resisting structure material using the resin are provided, where the resin is improved in the processability, has good heat resistance and insulating property and is soluble even in a low polar solvent. CONSTITUTION: The polyamideimide resin is represented by the formula; and has a number mean molecular weight of 2x10¬4 to 8x10¬4 g/mol. The method comprises the step of polymerizing an aromatic dicarboxylic acid and the aromatic diamine represented by the formula H2N-Ar-NH2 in the molar ratio of 1 : 0.5-2. Preferably the aromatic dicarboxylic acid is 1,5-bis(trimellitimido)-2,4,6-trimethylbenzene; and the aromatic diamine is 1,4-phenylene dianiline, 2,4-diamino mesitylene, 2,2'-dimethyl-4,4'-diaminobiphenyl or 2,2'-bis(trifluoromethyl)-4,4-diaminobiphenyl. The highly heat resisting structure material is obtained by coating a structure material with the polyamideimide resin.

Abstract translation: 目的：提供使用芳族二羧酸的新型聚酰胺酰亚胺树脂及其制备方法和使用该树脂的高耐热结构材料，其中树脂的加工性提高，具有良好的耐热性和绝缘性，并且即使在 低极性溶剂。 构成：聚酰胺酰亚胺树脂用下式表示： 并且具有2×10 -4至8×10 4 g / mol的数均分子量。 该方法包括以1:0.5-2的摩尔比聚合芳族二羧酸和由式H2N-Ar-NH2表示的芳族二胺的步骤。 芳族二羧酸优选为1,5-双（偏苯三酰亚氨基）-2,4,6-三甲基苯; 芳族二胺为1,4-亚苯基二苯胺，2,4-二氨基均三甲苯，2,2'-二甲基-4,4'-二氨基联苯或2,2'-双（三氟甲基）-4,4-二氨基联苯。 通过用聚酰胺酰亚胺树脂涂覆结构材料获得高耐热结构材料。

公开(公告)号：KR100460891B1

公开(公告)日：2004-12-09

申请号：KR1020010053443

申请日：2001-08-31

Applicant: 한학수

Inventor： 한학수 ,  이춘근 ,  민경옥 ,  이충봉

IPC: C08G73/14

Abstract: PURPOSE: A novel polyamideimide resin using an aromatic dicarboxylic acid, its preparation method and a highly heat resisting structure material using the resin are provided, where the resin is improved in the processability, has good heat resistance and insulating property and is soluble even in a low polar solvent. CONSTITUTION: The polyamideimide resin is represented by the formula; and has a number mean molecular weight of 2x10¬4 to 8x10¬4 g/mol. The method comprises the step of polymerizing an aromatic dicarboxylic acid and the aromatic diamine represented by the formula H2N-Ar-NH2 in the molar ratio of 1 : 0.5-2. Preferably the aromatic dicarboxylic acid is 1,5-bis(trimellitimido)-2,4,6-trimethylbenzene; and the aromatic diamine is 1,4-phenylene dianiline, 2,4-diamino mesitylene, 2,2'-dimethyl-4,4'-diaminobiphenyl or 2,2'-bis(trifluoromethyl)-4,4-diaminobiphenyl. The highly heat resisting structure material is obtained by coating a structure material with the polyamideimide resin.

Abstract translation: 目的：提供一种使用芳族二羧酸的新型聚酰胺酰亚胺树脂及其制备方法和使用该树脂的高耐热结构材料，其中树脂的可加工性得到改进，具有良好的耐热性和绝缘性，并且即使在 低极性溶剂。 构成：聚酰胺酰亚胺树脂由下式表示： 并具有2×10 4的数均分子量; 4至8×10 4和4g / mol。 该方法包括以1:0.5-2的摩尔比聚合芳族二羧酸和由式H 2 N-Ar-NH 2表示的芳族二胺的步骤。 优选芳族二羧酸为1,5-双（三（甲基亚氨基）-2,4,6-三甲基苯; 并且芳族二胺是1,4-亚苯基二苯胺，2,4-二氨基均三甲苯，2,2'-二甲基-4,4'-二氨基联苯或2,2'-双（三氟甲基）-4,4-二氨基联苯。 高耐热结构材料通过用聚酰胺酰亚胺树脂涂覆结构材料而获得。