公开(公告)号：KR1020020035268A

公开(公告)日：2002-05-11

申请号：KR1020000065493

申请日：2000-11-06

Applicant: 한학수

Inventor： 한학수 ,  장원봉 ,  정현수 ,  이종회

IPC: C08G73/10

Abstract: PURPOSE: Provided is an insulating polyimide copolymer used as an adhesion material for a package of a fine electronic element, which can control stress properties according to the property of each substrate. CONSTITUTION: The insulating polyimide copolymer is produced by preparing a polyamic acid by using 1,2,4,5-benztetracarboxylic dianhydride(PMDA) of formula 1, bisphenyl tetracarboxyphenyl dianhydride(BPDA) of formula 2, and 1,4-phenylene diamine(PDA) of formula 3 as monomers and then performing a thermal imidation. In the preparation of the polyimide copolymer by the thermal imidation, the property of a thin film is changed according to the condition of the process.

Abstract translation: 目的：提供一种绝缘聚酰亚胺共聚物，其用作电子元件的封装的粘合材料，其能够根据每个基板的性质来控制应力特性。 构成：通过使用式1的1,2,4,5-苯并四羧酸二酐（PMDA），式2的双苯基四羧基苯基二酐（BPDA）和1,4-亚苯基二胺（ PDA）作为单体，然后进行热酰亚胺化。 在通过热酰亚胺化制备聚酰亚胺共聚物时，根据工艺条件改变薄膜的性能。

公开(公告)号：KR1020020007426A

公开(公告)日：2002-01-29

申请号：KR1020000038797

申请日：2000-07-07

Applicant: 한학수

Inventor： 한학수 ,  장원봉 ,  정현수 ,  이종회

IPC: C08G59/14

CPC classification number: C08G73/1053 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1082 ,  H01L23/293 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE: Provided is a method for producing high performance epoxyimide for a package of a micro electronic element which has a low thermal stress resistance, wetting resistance, insulating properties and adhesiveness, as well as superior thermal and chemical stabilities and can be used in the super precision electronic industry. CONSTITUTION: The epoxyimide(formula 1) is synthesized by using an epoxy resin being excellent in flowability and moldability and a polyimide being excellent in thermal stress resistance, insulating property and wetting resistance. In order to prevent a pure liquid epoxy from contracting due to the surface tension of epoxide ring existing in a terminal group after being coated during the process, the polyimide having a hydroxyl group is used to open and bond to the epoxide ring. Also, a fluorine-containing group as a functional group is introduced to the polyimide chain to improve the formation of the thin film during the packaging process of thin film and also thermal stress resistance, insulating property and wetting resistance.

Abstract translation: 目的：提供具有低耐热性，耐湿性，绝缘性和粘合性以及优异的热和化学稳定性的用于微电子元件封装的高性能环氧酰亚胺的方法，并且可用于超级 精密电子工业。 构成：通过使用流动性和成型性优异的环氧树脂和耐热应力性，绝缘性和耐湿性优异的聚酰亚胺来合成环氧酰亚胺（式1）。 为了防止在该工艺中涂覆后由于存在于端基中的环氧化物环的表面张力而导致纯液体环氧树脂收缩，使用具有羟基的聚酰亚胺与环氧化物环开环并键合。 此外，将作为官能团的含氟基团引入到聚酰亚胺链中，以改善薄膜包装过程中薄膜的形成以及耐热应力性，绝缘性和耐湿性。

公开(公告)号：KR100377861B1

公开(公告)日：2003-03-29

申请号：KR1020000038797

申请日：2000-07-07

Applicant: 한학수

Inventor： 한학수 ,  장원봉 ,  정현수 ,  이종회

IPC: C08G59/14

CPC classification number: C08G73/1053 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1082 ,  H01L23/293 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This invention provides novel epoxy-polyimide composites and process for producing the same which has excellent thermal stability and mechanical properties whereby soluble reactive polyimide containing hydroxyl functional group were used as a curing agent. The novel epoxy-polyimide composites, which is polymerized by reacting epoxy resin and polyimide during curing process, can be widely used as insulating intermediate layer in integrated circuits and electronic circuit encapsulants. The invention also provides an epoxy resin/polyimide composition comprising an epoxy resin and a polyimide.

Abstract translation: 本发明提供新颖的环氧 - 聚酰亚胺复合材料及其制造方法，其具有优异的热稳定性和机械性能，其中使用含羟基官能团的可溶性反应性聚酰亚胺作为固化剂。 新型环氧树脂 - 聚酰亚胺复合材料在固化过程中通过环氧树脂与聚酰亚胺反应聚合而成，可广泛用作集成电路和电子电路封装材料中的绝缘中间层。 本发明还提供了包含环氧树脂和聚酰亚胺的环氧树脂/聚酰亚胺组合物。

公开(公告)号：KR100796034B1

公开(公告)日：2008-01-21

申请号：KR1020000065493

申请日：2000-11-06

Applicant: 한학수

Inventor： 한학수 ,  장원봉 ,  정현수 ,  이종회

IPC: C08G73/10

Abstract: 본 발명은 폴리이미드 공중합체 및 그 제조방법에 관한 것으로서, 더욱 구체적으로는, 하기 화학식 1로 표시되는 반복단위 및 하기 화학식 2로 표시되는 반복단위를 포함하는 폴리이미드 공중합체 및 그 제조방법에 관한 것이다:



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본 발명에 따르면, 응력의 조절 및 최소화가 가능한 폴리이미드 공중합체의 제조방법을 제공할 수 있으며, 제조된 폴리이미드 공중합체는 고성능 전자 소자의 재료로서 금속, 실리콘, 세라믹 및 플라스틱 등과 같은 기판과 절연성 고분자와의 경계면에서 물리적 특성 차이로 인한 응력이 집적 소자의 균열이나 층간 박리와 같은 치명적인 문제를 야기하는 것을 방지하며, 따라서 전자 소자 패키지용 소재로서의 신뢰도 향상을 꾀할 수 있다.
폴리이미드 공중합체, 잔류 응력, 패키지, 절연성