公开(公告)号：US10199603B2

公开(公告)日：2019-02-05

申请号：US14907276

申请日：2014-07-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Joseph M. Pieper ,  Eric W. Nelson ,  Fred B. McCormick ,  Karissa L. Eckert ,  Adam M. Nebraska

IPC: H01L51/56 ,  C09J5/00 ,  C08J7/04 ,  H01L51/52 ,  G02F1/13357 ,  H01L27/32 ,  H01L51/00 ,  H01L51/50 ,  G02F1/1335

Abstract: The present disclosure relates to forming a bond with a high peel resistance between a bonding layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of a device, in particular a luminescent device, and a method is described for assembly of the luminescent device. The luminescent device includes an encapsulation system using flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. The moisture sensitive luminescent material can be, for example, a quantum dot material disposed in a film, or a film construction that includes an OLED structure.