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公开(公告)号：US10738224B2
公开(公告)日：2020-08-11
申请号：US15753222
申请日：2016-08-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jacob P. Johnson , Fred B. McCormick , Adam J. Meuler , Richard J. Pokorny , Daniel J. Schmidt
IPC: B32B27/36 , B32B7/12 , B32B27/34 , B32B27/28 , B32B27/20 , B32B27/08 , B32B27/32 , C09J123/22 , C09J7/38 , C09J7/22 , C09J11/04 , C08K5/19 , C08K9/06 , C08K9/04 , C08L23/22 , C08K3/34 , H01L51/52
Abstract: A barrier adhesive composition comprising a resin system and organically modified nanoclay. The resin system comprises (a) a first polyisobutylene resin having a viscosity average molecular weight of about 300,000 to about 500,000 g/mol, (b) a second polyisobutylene resin having a viscosity average molecular of about 700,000 to about 900,000 g/mol and (c) tackifier.
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公开(公告)号：US10581015B2
公开(公告)日：2020-03-03
申请号：US15752859
申请日：2016-08-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jacob P. Johnson , Fred B. McCormick , Adam J. Meuler , Richard J. Pokorny , Daniel J. Schmidt
IPC: H01L21/02 , H01L51/52 , C09J123/22 , C08K3/34 , H01L23/29 , C09J7/30 , C08K9/04 , C09J11/04 , C09J11/06 , H01L51/00
Abstract: A barrier film construction comprises an ultra-barrier film and a barrier adhesive. The adhesive layer comprises a barrier adhesive composition comprising a resin system and organically modified nanoclay; wherein the resin system comprises a first polyisobutylene resin having a viscosity average molecular weight of about 100,000 to about 1,200,000 g/mol and tackifier.
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Patent Agency Ranking
公开(公告)号：US10654251B2
公开(公告)日：2020-05-19
申请号：US15739168
申请日：2016-06-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： David J. Rowe , Ta-Hua Yu , Timothy J. Lindquist , Mark A. Roehrig , Christopher S. Lyons , Stephen P. Maki , Scott J. Jones , Kevin D. Hagen , Andrew M. Mevissen , Kenneth L. Looney , Stephen A. Johnson , Terence D. Neavin , Joseph C. Spagnola , Fred B. McCormick
Abstract: Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.
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公开(公告)号：US20180370200A1
公开(公告)日：2018-12-27
申请号：US15739168
申请日：2016-06-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： David J. Rowe , Ta-Hua Yu , Timothy J. Lindquist , Mark A. Roehrig , Christopher S. Lyons , Stephen P. Maki , Scott J. Jones , Kevin D. Hagen , Andrew M. Mevissen , Kenneth L. Looney , Stephen A. Johnson , Terence D. Neavin , Joseph C. Spagnola , Fred B. McCormick
Abstract: Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.
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公开(公告)号：US10199603B2
公开(公告)日：2019-02-05
申请号：US14907276
申请日：2014-07-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Joseph M. Pieper , Eric W. Nelson , Fred B. McCormick , Karissa L. Eckert , Adam M. Nebraska
IPC: H01L51/56 , C09J5/00 , C08J7/04 , H01L51/52 , G02F1/13357 , H01L27/32 , H01L51/00 , H01L51/50 , G02F1/1335
Abstract: The present disclosure relates to forming a bond with a high peel resistance between a bonding layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of a device, in particular a luminescent device, and a method is described for assembly of the luminescent device. The luminescent device includes an encapsulation system using flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. The moisture sensitive luminescent material can be, for example, a quantum dot material disposed in a film, or a film construction that includes an OLED structure.
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公开(公告)号：US10114257B2
公开(公告)日：2018-10-30
申请号：US15398816
申请日：2017-01-05
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Fred B. McCormick , Sergey Lamansky , Leslie A. Todero , Manoj Nirmal
IPC: G02F1/1343 , H01L51/44 , H01L51/52 , H01L31/0224 , G02F1/1333 , G02F1/1334 , G02F1/167
Abstract: A conducting film or device multilayer electrode includes a substrate and two transparent or semitransparent conductive layers separated by a transparent or semitransparent intervening layer. The intervening layer includes electrically conductive pathways between the first and second conductive layers to help reduce interfacial reflections occurring between particular layers in devices incorporating the conducting film or electrode.
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7.发明申请公开(公告)号：US20170115521A1
公开(公告)日：2017-04-27
申请号：US15398816
申请日：2017-01-05
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Fred B. McCormick , Sergey Lamansky , Leslie A. Todero , Manoj Nirmal
IPC: G02F1/1343 , H01L51/52 , G02F1/1333 , H01L51/44 , G02F1/1334 , G02F1/167
CPC classification number: G02F1/13439 , G02F1/133305 , G02F1/133345 , G02F1/1334 , G02F1/167 , G02F2001/1676 , G02F2201/42 , G02F2203/01 , H01L31/022466 , H01L31/022475 , H01L51/442 , H01L51/5215 , Y02E10/549
Abstract: A conducting film or device multilayer electrode includes a substrate and two transparent or semitransparent conductive layers separated by a transparent or semitransparent intervening layer. The intervening layer includes electrically conductive pathways between the first and second conductive layers to help reduce interfacial reflections occurring between particular layers in devices incorporating the conducting film or electrode.
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