公开(公告)号：US20230019334A1

公开(公告)日：2023-01-19

申请号：US17779623

申请日：2019-12-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Antonny Flor ,  Sheldon B. Ruiz ,  Milind B. Sabade

IPC: H01L35/34 ,  H01L35/16 ,  H01L35/22 ,  H01L35/30 ,  H01L35/32

Abstract: The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.

公开(公告)号：US12004424B2

公开(公告)日：2024-06-04

申请号：US17779623

申请日：2019-12-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Antonny Flor ,  Sheldon B. Ruiz ,  Milind B. Sabade

IPC: H10N10/01 ,  H10N10/13 ,  H10N10/17 ,  H10N10/852 ,  H10N10/855

CPC classification number: H10N10/01 ,  H10N10/13 ,  H10N10/17 ,  H10N10/852 ,  H10N10/855

Abstract: The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.