公开(公告)号：WO2018111584A1

公开(公告)日：2018-06-21

申请号：PCT/US2017/064411

申请日：2017-12-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： LIU, Richard Y. ,  PENNINGTON, Brian D. ,  HO, Victor

IPC: B32B17/10 ,  B32B7/12 ,  B32B7/06 ,  C09J153/00 ,  C09J7/25 ,  G06F3/041

Abstract: A planarization tape and a touch sensor assembly including a cover glass, a touch sensor film bonded to the cover glass through an optically clear adhesive layer and the planarization tape releasably bonded to the touch sensor film is described. The planarization tape includes a polymeric substrate and a releasable adhesive layer bonded to the substrate. The substrate has a thickness between 250 micrometers and 5 mm, and the adhesive layer has a thickness between 5 micrometers and 100 micrometers. The adhesive layer may be adapted to releaseably bond to at least one of glass and cyclic olefin polymer film

公开(公告)号：WO2016036682A1

公开(公告)日：2016-03-10

申请号：PCT/US2015/047851

申请日：2015-09-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： CAMPBELL, Christopher J. ,  PENNINGTON, Brian D. ,  TSAI, Han-Chi ,  CHIANG, Tzong-Yiing

IPC: C08G18/62 ,  C08F8/30 ,  C09J4/00 ,  C09J133/08 ,  C09J7/02 ,  C09J133/06 ,  C09J133/14 ,  C09J143/04 ,  C08F220/18

CPC classification number: C09J5/00 ,  B05D3/067 ,  C08F8/30 ,  C08F220/18 ,  C08F2220/1875 ,  C08F2220/1891 ,  C08G18/6229 ,  C08G18/8116 ,  C08K5/06 ,  C08K5/37 ,  C09J4/00 ,  C09J7/20 ,  C09J11/06 ,  C09J133/066 ,  C09J133/08 ,  C09J133/14 ,  C09J143/04 ,  C09J2203/10 ,  C09J2205/31 ,  C09J2400/143 ,  C09J2433/00 ,  C08F220/20 ,  C08F222/20 ,  C08F2220/1858

Abstract: The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm 2 and about 10,000 mJ/cm 2 The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30k and a Tg of less than about 20 °C, a diluents monomer component and a photoinitiator.

Abstract translation: 本发明是一种将至少部分位于光吸收层下方的粘合剂组合物固化的方法。 该方法包括提供粘合剂组合物，将光吸收层定位在粘合剂组合物的表面上，使得存在粘合剂组合物的暴露区域和粘合剂组合物的覆盖区域并照射粘合剂组合物的暴露区域， 表面上的粘合剂组合物的覆盖面积为约100mJ / cm 2至约10,000mJ / cm 2。粘合剂组合物包括分子量为4至30kk且Tg较小的溶质（甲基）丙烯酰低聚物 约20℃，稀释剂单体组分和光引发剂。