公开(公告)号：WO2006068766A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/042655

申请日：2005-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： OUDERKIRK, Andrew J. ,  TRAN, Hung T. ,  SCHULTZ, John C. ,  WHEATLEY, John A. ,  HOFFMAN, Joseph A. ,  SCHENKE, Kay-uwe ,  MEIS, Michael A. ,  POJAR, Stephen J. ,  LEHNHARDT, Wolfgang N.

IPC: H01L33/60 ,  H01L33/64

CPC classification number: H05K1/021 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.

Abstract translation: 一种照明组件，包括导热衬底，靠近导热衬底的主表面的图案化导电层，位于图案化导电层和衬底主表面之间的电介质层，以及至少一个LED，其包括柱 附接到导热基板，使得柱的至少一部分嵌入导热基板中。 所述至少一个LED可以通过柱热连接到导热基板，并电连接到图案化的导电层。 电介质层可以是反射性的。

公开(公告)号：WO2006068765A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/042654

申请日：2005-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： OUDERKIRK, Andrew J. ,  TRAN, Hung T. ,  SCHULTZ, John C. ,  WHEATLEY, John A. ,  SCHENKE, Kay-uwe ,  MEIS, Michael A. ,  POJAR, Stephen J. ,  LEHNHARDT, Wolfgang N.

IPC: H01L33/60 ,  H01L33/64

CPC classification number: H01L33/642 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014

Abstract: An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the major surface of the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.

Abstract translation: 一种照明组件，包括导热衬底，靠近导热衬底的主表面的图案化导电层，位于图案化导电层和衬底主表面之间的电介质层，以及至少一个LED，其包括柱 公开了附着在导热基底的主表面上。 所述至少一个LED可以经由柱热连接到导热基板，并电连接到图案化的导电层。 电介质层可以是反射性的。

公开(公告)号：EP1829123A2

公开(公告)日：2007-09-05

申请号：EP05825488.9

申请日：2005-11-23

Applicant: 3M Innovative Properties Company

Inventor： OUDERKIRK, Andrew J. ,  TRAN, Hung T. ,  SCHULTZ, John C. ,  WHEATLEY, John A. ,  HOFFMAN, Joseph A. ,  SCHENKE, Kay-uwe ,  MEIS, Michael A. ,  POJAR, Stephen J. ,  LEHNHARDT, Wolfgang N.

IPC: H01L33/00

CPC classification number: H05K1/021 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination assembly (200) including a thermally conductive substrate (212), a patterned conductive layer (218) proximate a major surface (214) of the thermally conductive substrate, a dielectric layer (216) positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED (220) including a post (230) that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.

Abstract translation: 一种照明组件（200），包括导热基板（212），接近导热基板的主表面（214）的图案化导电层（218），位于图案化导电层和主要表面之间的介电层（216） 以及至少一个LED（220），所述LED包括附接到所述导热基板的柱（230），使得所述柱的至少一部分嵌入所述导热基板中。 所述至少一个LED可以通过柱热连接到导热基板并且电连接到图案化导电层。 介电层可以是反射性的。