公开(公告)号：WO2011159456A3

公开(公告)日：2011-12-22

申请号：PCT/US2011/038281

申请日：2011-05-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  TRAN, Hung T. ,  SAITO, Kazuta

Inventor： TRAN, Hung T. ,  SAITO, Kazuta

IPC: H01L21/683

Abstract: The present invention is a laminated body including a substrate, a joining layer positioned adjacent the substrate, a photothermal conversion layer positioned adjacent the joining layer, and a light transmitting support positioned adjacent the photothermal conversion layer. The photothermal conversion layer includes a metal absorbing layer.

公开(公告)号：WO2017180502A1

公开(公告)日：2017-10-19

申请号：PCT/US2017/026776

申请日：2017-04-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： LE, John D. ,  DAVID, Moses M. ,  MCCUTCHEON, Jeffrey W. ,  TRAN, Hung T.

IPC: H05K3/12 ,  H05K3/14 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/1275 ,  H05K3/0014 ,  H05K3/146 ,  H05K3/321 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/0528 ,  H05K2203/095

Abstract: Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.

Abstract translation: 包括电路的多层制品通过将电路元件粘合剂转移到粘合剂表面来制备。 使用许多不同的方法，所有方法包括在释放衬底上使用简单的电路形成材料层和构造成产生可转移到粘合剂表面的电路元件。 在一些方法中，使用结构化释放基板来选择性地传送电路形成材料，或者从释放基板上的突起或者释放基板上的凹陷处传送电路形成材料。 在其他方法中，使用非结构化释放基材并且压花以形成结构化释放基材或与结构化粘合剂层接触以选择性地传递电路形成材料。

公开(公告)号：WO2006068766A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/042655

申请日：2005-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： OUDERKIRK, Andrew J. ,  TRAN, Hung T. ,  SCHULTZ, John C. ,  WHEATLEY, John A. ,  HOFFMAN, Joseph A. ,  SCHENKE, Kay-uwe ,  MEIS, Michael A. ,  POJAR, Stephen J. ,  LEHNHARDT, Wolfgang N.

IPC: H01L33/60 ,  H01L33/64

CPC classification number: H05K1/021 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.

Abstract translation: 一种照明组件，包括导热衬底，靠近导热衬底的主表面的图案化导电层，位于图案化导电层和衬底主表面之间的电介质层，以及至少一个LED，其包括柱 附接到导热基板，使得柱的至少一部分嵌入导热基板中。 所述至少一个LED可以通过柱热连接到导热基板，并电连接到图案化的导电层。 电介质层可以是反射性的。

公开(公告)号：WO2006068765A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/042654

申请日：2005-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： OUDERKIRK, Andrew J. ,  TRAN, Hung T. ,  SCHULTZ, John C. ,  WHEATLEY, John A. ,  SCHENKE, Kay-uwe ,  MEIS, Michael A. ,  POJAR, Stephen J. ,  LEHNHARDT, Wolfgang N.

IPC: H01L33/60 ,  H01L33/64

CPC classification number: H01L33/642 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014

Abstract: An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the major surface of the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.

Abstract translation: 一种照明组件，包括导热衬底，靠近导热衬底的主表面的图案化导电层，位于图案化导电层和衬底主表面之间的电介质层，以及至少一个LED，其包括柱 公开了附着在导热基底的主表面上。 所述至少一个LED可以经由柱热连接到导热基板，并电连接到图案化的导电层。 电介质层可以是反射性的。

公开(公告)号：EP1829123A2

公开(公告)日：2007-09-05

申请号：EP05825488.9

申请日：2005-11-23

Applicant: 3M Innovative Properties Company

Inventor： OUDERKIRK, Andrew J. ,  TRAN, Hung T. ,  SCHULTZ, John C. ,  WHEATLEY, John A. ,  HOFFMAN, Joseph A. ,  SCHENKE, Kay-uwe ,  MEIS, Michael A. ,  POJAR, Stephen J. ,  LEHNHARDT, Wolfgang N.

IPC: H01L33/00

CPC classification number: H05K1/021 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination assembly (200) including a thermally conductive substrate (212), a patterned conductive layer (218) proximate a major surface (214) of the thermally conductive substrate, a dielectric layer (216) positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED (220) including a post (230) that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.

Abstract translation: 一种照明组件（200），包括导热基板（212），接近导热基板的主表面（214）的图案化导电层（218），位于图案化导电层和主要表面之间的介电层（216） 以及至少一个LED（220），所述LED包括附接到所述导热基板的柱（230），使得所述柱的至少一部分嵌入所述导热基板中。 所述至少一个LED可以通过柱热连接到导热基板并且电连接到图案化导电层。 介电层可以是反射性的。

公开(公告)号：EP1829125A2

公开(公告)日：2007-09-05

申请号：EP05852145.1

申请日：2005-11-23

Applicant: 3M Innovative Properties Company

Inventor： HOFFMAN, Joseph A. ,  TRAN, Hung T. ,  MEIS, Michael A. ,  OUDERKIRK, Andrew J.

IPC: H01L33/00

CPC classification number: H01L33/642 ,  F21K9/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination assembly (200) including a thermally conductive substrate (212), a reflective layer (240) proximate a first major surface (214) of the thermally conductive substrate, a patterned conductive layer (250) positioned between the reflective layer and the first major surface of the thermally conductive substrate and electrically isolated from the thermally conductive substrate, and at least one LED (220) including a post (230) that is attached to the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer.

Abstract translation: 一种照明组件，包括导热衬底，靠近导热衬底的第一主表面的反射层，位于反射层和导热衬底的第一主表面之间的图案化导电层，并与导热衬底电隔离 并且公开了包括附接到导热基板的柱的至少一个LED。 所述至少一个LED可以通过柱热连接到导热基板，并电连接到图案化的导电层。