公开(公告)号：WO1998011767A1

公开(公告)日：1998-03-19

申请号：PCT/US1997015031

申请日：1997-08-26

Applicant: ABB POWER T & D COMPANY INC.

Inventor： ABB POWER T & D COMPANY INC. ,  BOWLER, Colin, E., J. ,  CELY, Joe ,  WINN, Jackie, L. ,  McRAY, Robert, D. ,  MOELLER, Thomas, C. ,  BAPAT, Vinod, N.

IPC: H05K07/20

CPC classification number: H05K7/20572 ,  H01L25/112 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20909 ,  H01L2924/00

Abstract: A silicon transfer switch (10) having a compact and modular arrangement of solid state switch components (14) within the switch boxes (10). The components are arranged in modular half-stack assemblies (14) such that the half-stacks can be loaded into and out of compartments (12) within the switch boxes (10) in an efficient and timely manner. The cooling system minimizes temperature and pressure gradients in the flow of air to the electronic components arranged in the stacks (14) so as to provide uniform cooling of the components. The compact and modular arrangement of the switch components optimizes electrical interconnection between components, mechanical clamping forces, thermal cooling, magnetically coupled solid state switch device firing and temperature management within the system.

Abstract translation: 具有在开关盒（10）内的固态开关部件（14）的紧凑且模块化布置的硅转移开关（10）。 部件被布置在模块化半堆叠组件（14）中，使得半堆叠能够以有效和及时的方式装载到开关盒（10）内的隔室（12）中。 冷却系统使排出在堆叠（14）中的电子部件的空气流中的温度和压力梯度最小化，从而提供组件的均匀冷却。 开关组件的紧凑和模块化布置优化了组件之间的电气互连，机械夹紧力，热冷却，磁耦合固态开关器件烧制和系统内的温度管理。