公开(公告)号：EP2276329A1

公开(公告)日：2011-01-19

申请号：EP09165670.2

申请日：2009-07-16

Applicant: ABB Research Ltd.

Inventor： Coppola, Luisa ,  Fabbri, Matteo ,  Schmidt, Roland ,  Cottet, Didier

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: The invention relates to an electronic circuit board comprising at least one conductor path (6, 6') and at least one component (3) which is one of an electronic component, electric component and heat emitting component and which is connected to said conductor path (6, 6'). At least one thermal capacitor (4) is thermally connected to said conductor (6) in vicinity to said at least one component (3), wherein the at least one thermal capacitor (4) is suitable for transmitting and/or buffering thermal energy of the at least one component.

Abstract translation: 本发明涉及一种电子电路板，其包括至少一个导体路径（6,6'）和至少一个组件（3），该组件（3）是电子部件，电气部件和发热部件之一，并且连接到所述导体路径 （6,6'）。 至少一个热电容器（4）在所述至少一个部件（3）附近热连接到所述导体（6），其中所述至少一个热电容器（4）适于传输和/或缓冲 该至少一个部件。