公开(公告)号：EP4421504A1

公开(公告)日：2024-08-28

申请号：EP23158019.2

申请日：2023-02-22

Applicant: ABB SCHWEIZ AG

Inventor： Kohvakka, Mikko ,  Kovanen, Kari ,  Hakkarainen, Henri

IPC: G01R31/28 ,  H05K1/02

CPC classification number: H05K1/0268 ,  H05K2201/076920130101 ,  H05K1/0254 ,  G01R31/2812

Abstract: The present invention relates to the field of electric drive devices and arrangements comprising a plurality of power semiconductor components formed in or on a common substrate, and more particularly to an arrangement for monitoring the condition of a power semiconductor module of an electric drive device and an electric drive device. The arrangement for monitoring the condition of a power semiconductor module of an electric drive device comprises an at least one pair of sensor elements (11-16, 41-42, 51-52, 61-64, 71-76, 81-90) arranged on a printed circuit board parallel next to each other as sensor element pairs of PCB copper trace sensor elements, wherein every other PCB copper trace sensor element (11, 13, 15, 41, 51, 61, 63, 71, 73, 75, 81, 83, 85, 87, 89) of each sensor element pair is connected to a positive (UDC+) and every other PCB copper trace sensor element (12, 14, 15, 42, 52, 62, 64, 72, 74, 76, 82, 84, 86, 88, 90) of each sensor element pair is connected to a negative (UDC-) DC supply voltage source of said electric drive device, and wherein the DC supply voltage of said electric drive device is applied to said at least one pair of sensor elements (11-16, 41-42, 51-52, 61-64, 71-76, 81-90).

公开(公告)号：EP4539119A1

公开(公告)日：2025-04-16

申请号：EP23202989.2

申请日：2023-10-11

Applicant: ABB Schweiz AG

Inventor： Hakkarainen, Henri ,  Varsila, Pauli ,  Koivuluoma, Timo

IPC: H01L23/40 ,  H01L21/48

Abstract: The invention relates to a mounting tool (1) for connecting an electronic component to a cooling surface via a thermal interface material foil (2). To enable simple connecting work without damaging the thermal interface material foil, the mounting tool comprises: a base surface (3) with a reception area (4) dimensioned to receive the thermal interface material foil (2), spacers (7, 10) protruding from the base surface (3) and notches (14) provided at a first outer edge (13) of the base surface (3) at positions which are aligned with first attachment holes (15) provided in the thermal interface material foil (2) for allowing screws or bolts (17) to pass through first attachment holes (15) of the thermal interface material foil (2) and the notches (14) when the electric component (5), the thermal interface material foil (2) and the mounting tool (1) are in a stacked connecting position.

公开(公告)号：EP3410472A1

公开(公告)日：2018-12-05

申请号：EP17173631.7

申请日：2017-05-31

Applicant: ABB Schweiz AG

Inventor： Hakkarainen, Henri

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/42

CPC classification number: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/4006

Abstract: A cooling arrangement of a power semiconductor module, the arrangement comprises a power semiconductor module having a base plate, a cooling element having a cooling surface and a solid thermal interface material layer, wherein the power semiconductor module comprises two or more attachment holes and the cooling element comprises attachment holes the positions of which correspond to the attachment holes of the power semiconductor module, the attachment holes being provided for attaching the power semiconductor module to the cooling element, the thermal interface material layer is arranged between the base plate of the power semiconductor module and the cooling surface of the cooling element, wherein the edge of the thermal interface material layer is at a distance from the attachment holes and the thermal interface material layer has curved cut-outs in the positions of the attachment holes.