Abstract:
A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).
Abstract:
A cooled electrical assembly comprising at least one choke coil (2) having a plurality of coil turns wound around a choke centre line, a liquid cooling element (4) adapted for cooling the at least one choke coil (2), the liquid cooling element (4) having a first cooling surface (41) that is in heat conducting connection with a first outer surface area (21) of the at least one choke coil (2). The cooled electrical assembly comprises at least one a heat conduction element (6) that is in heat conducting connection with the first cooling surface (41) of the liquid cooling element (4), and with a second outer surface area (22) of the at least one choke coil (2) located on an opposite side of the choke centre line than the first outer surface area (21).
Abstract:
A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).
Abstract:
A thermal interface material sheet, method of manufacturing a thermal interface material sheet and an electrical device. The thermal interface material sheet is to be disposed between a heat generating electrical component and a cooling device, the thermal interface material sheet comprising at least one thin film sensor and electrical conductors connected to the at least one thin film sensor for measuring a property related to the heat generating electrical component.
Abstract:
The invention relates to a mounting tool (1) for connecting an electronic component to a cooling surface via a thermal interface material foil (2). To enable simple connecting work without damaging the thermal interface material foil, the mounting tool comprises: a base surface (3) with a reception area (4) dimensioned to receive the thermal interface material foil (2), spacers (7, 10) protruding from the base surface (3) and notches (14) provided at a first outer edge (13) of the base surface (3) at positions which are aligned with first attachment holes (15) provided in the thermal interface material foil (2) for allowing screws or bolts (17) to pass through first attachment holes (15) of the thermal interface material foil (2) and the notches (14) when the electric component (5), the thermal interface material foil (2) and the mounting tool (1) are in a stacked connecting position.
Abstract:
A cooling device comprising a first chamber (1), a second chamber (2) separated from the first chamber (1), heat exchanger means (4) adapted to transfer heat from the first chamber (1) to the second chamber (2), and fan means. The first chamber (1) comprises an inlet flow opening (12) and an outlet flow opening (14). The fan means is adapted to generate a first cooling medium flow (511) inside the first chamber (1) between the inlet flow opening (12) and the outlet flow opening (14) such that heat is transferred from the first cooling medium flow (511) into the heat exchanger means.