公开(公告)号：EP2637489B1

公开(公告)日：2018-01-24

申请号：EP12158288.6

申请日：2012-03-06

Applicant: ABB Schweiz AG

Inventor： Drofenik, Uwe ,  Huesgen, Till ,  Ecklebe, Andreas

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20518

Abstract: An electrical power circuit assembly 1 comprises a heat sink 10 having a first surface portion 12 and a second surface portion 14; a power semiconductor module 20 being in thermal contact with the first surface portion 12 of the heat sink 10 for dissipating heat from the power semiconductor module 20 to the heat sink 10 via the first heat sink surface portion 12; and a capacitor 30 having an axis 32. The capacitor 30 is arranged with its axis 32 essentially parallel to the second heat sink surface portion 14 and with a circumferential surface 34 portion being in thermal contact with the second surface portion 14 of the heat sink 10 for dissipating heat from the capacitor 30 to the heat sink 10 via the second heat sink surface portion 14.