公开(公告)号：US20190239337A1

公开(公告)日：2019-08-01

申请号：US16262991

申请日：2019-01-31

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen ,  Kjell Ingman

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H01L23/373

CPC classification number: H05K1/0203 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/433 ,  H05K3/0061 ,  H05K3/341

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

公开(公告)号：US20200006190A1

公开(公告)日：2020-01-02

申请号：US16023252

申请日：2018-06-29

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Kjell Ingman

IPC: H01L23/373 ,  H01L23/367 ,  H05K7/20 ,  H01L25/07 ,  H01L21/48

Abstract: The present application relates to a heat transfer structure, power electronics module, cooling element and methods of manufacturing a heat transfer structure and a power electronics component. A heat transfer structure is utilized in a power electronics module. The heat transfer structure includes a metallic body and a carbon based insert.

公开(公告)号：US20210066157A1

公开(公告)日：2021-03-04

申请号：US16963357

申请日：2018-01-18

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Kjell Ingman ,  Joni Pakarinen

IPC: H01L23/373

Abstract: A power electronics module and a method of producing a power electronics module. The module includes multiple of power electronic semiconductor chips incorporated in a housing, and a heat transfer structure which forms an outer surface of the module and is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a metallic structure having a soft coating.

公开(公告)号：US10856403B2

公开(公告)日：2020-12-01

申请号：US16262991

申请日：2019-01-31

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen ,  Kjell Ingman

IPC: H05K7/20 ,  H01L21/58 ,  H01L23/00 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/367 ,  H01L23/373 ,  H01L33/64 ,  H05K1/02 ,  H05K3/34 ,  H05K3/00 ,  H01L23/42 ,  H01L23/433

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

公开(公告)号：US20190284030A1

公开(公告)日：2019-09-19

申请号：US16353518

申请日：2019-03-14

Applicant: ABB Schweiz AG

Inventor： Mikael Holmberg ,  Kjell Ingman ,  Michael Rodas

IPC: B66D1/50 ,  G05B19/416

Abstract: A method for operating a winch and an electric drive for driving a winch including a rotatable winch drum for spooling a spoolable medium and an electric motor operably coupled to the winch drum, the electric drive being configured to drive the winch drum by driving the electric motor such that a tension of the spoolable medium reaches a predetermined tension set point value or value range, and set a driving speed of the electric motor to zero, and after the setting of the driving speed of the electric motor to zero, drive the electric motor to alternate directions of rotation at predetermined driving speeds such that the direction of rotation is changed at a predetermined frequency.