公开(公告)号：US20210315130A1

公开(公告)日：2021-10-07

申请号：US17219247

申请日：2021-03-31

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen

IPC: H05K7/20

Abstract: A cooling element and a method of manufacturing a cooling element. The cooling element includes a body having a surface adapted to receive a heat source, wherein the body is formed of extrusion profile having open ends. The cooling element further includes plugs attached to the open ends of the body to close the body, and a port for filling working fluid inside the closed body.

公开(公告)号：US20210066157A1

公开(公告)日：2021-03-04

申请号：US16963357

申请日：2018-01-18

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Kjell Ingman ,  Joni Pakarinen

IPC: H01L23/373

Abstract: A power electronics module and a method of producing a power electronics module. The module includes multiple of power electronic semiconductor chips incorporated in a housing, and a heat transfer structure which forms an outer surface of the module and is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a metallic structure having a soft coating.

公开(公告)号：US10856403B2

公开(公告)日：2020-12-01

申请号：US16262991

申请日：2019-01-31

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen ,  Kjell Ingman

IPC: H05K7/20 ,  H01L21/58 ,  H01L23/00 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/367 ,  H01L23/373 ,  H01L33/64 ,  H05K1/02 ,  H05K3/34 ,  H05K3/00 ,  H01L23/42 ,  H01L23/433

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

公开(公告)号：US20190394898A1

公开(公告)日：2019-12-26

申请号：US16014684

申请日：2018-06-21

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Timo Koivuluoma

IPC: H05K7/20 ,  G01K7/16 ,  G01L1/18 ,  F28F21/02 ,  F28F21/08 ,  F28F21/06

Abstract: A thermal interface material sheet, method of manufacturing a thermal interface material sheet and an electrical device. The thermal interface material sheet is to be disposed between a heat generating electrical component and a cooling device, the thermal interface material sheet comprising at least one thin film sensor and electrical conductors connected to the at least one thin film sensor for measuring a property related to the heat generating electrical component.

公开(公告)号：US11297727B2

公开(公告)日：2022-04-05

申请号：US16598131

申请日：2019-10-10

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen

IPC: H01L23/00 ,  H05K7/14 ,  H05K7/20 ,  H01L23/373 ,  H01L23/31

Abstract: A power electronic component including a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips mounted on a substrate above the bottom surface, and a housing enclosing the one or more power electronic semiconductor chips. The power electronic component includes a thermal insulator disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator are on the opposite sides of the one or more power electronic semiconductor chips.

公开(公告)号：US20220015258A1

公开(公告)日：2022-01-13

申请号：US17369514

申请日：2021-07-07

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen

IPC: H05K7/20

Abstract: A power electronic assembly a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

公开(公告)号：US20200335417A1

公开(公告)日：2020-10-22

申请号：US16847850

申请日：2020-04-14

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen

IPC: H01L23/373 ,  H01L21/48 ,  F28F21/02 ,  F28F21/08

Abstract: A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

公开(公告)号：US20200006190A1

公开(公告)日：2020-01-02

申请号：US16023252

申请日：2018-06-29

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Kjell Ingman

IPC: H01L23/373 ,  H01L23/367 ,  H05K7/20 ,  H01L25/07 ,  H01L21/48

Abstract: The present application relates to a heat transfer structure, power electronics module, cooling element and methods of manufacturing a heat transfer structure and a power electronics component. A heat transfer structure is utilized in a power electronics module. The heat transfer structure includes a metallic body and a carbon based insert.

公开(公告)号：US11895810B2

公开(公告)日：2024-02-06

申请号：US17369514

申请日：2021-07-07

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen

IPC: H05K7/20

CPC classification number: H05K7/209

Abstract: A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

公开(公告)号：US11764125B2

公开(公告)日：2023-09-19

申请号：US16847850

申请日：2020-04-14

Applicant: ABB Schweiz AG

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Joni Pakarinen

IPC: H01L23/373 ,  F28F21/02 ,  F28F21/08 ,  H01L21/48 ,  B32B27/36 ,  B32B37/18

CPC classification number: H01L23/3735 ,  F28F21/02 ,  F28F21/089 ,  H01L21/4882 ,  B32B27/36 ,  B32B37/18

Abstract: A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.