公开(公告)号：EP2800131A1

公开(公告)日：2014-11-05

申请号：EP13165780.1

申请日：2013-04-29

Applicant: ABB Technology AG

Inventor： Liu, Chunlei ,  Brem, Franziska ,  Simon, Reinhard

IPC: H01L21/603

CPC classification number: H01L24/75 ,  H01L24/83 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/7511 ,  H01L2224/75272 ,  H01L2224/75317 ,  H01L2224/7598 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/05032 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of bonding an electronics semiconductor device (12) to a substrate (14) comprises the steps of: depositing a layer (20) of metallic particles on a bonding area of the semiconductor device (12) and/or of the substrate (14); positioning the semiconductor device (12) on the substrate (14), such that the layer (20) is positioned between the semiconductor device (12) and the substrate (14);enclosing the semiconductor device (12) and the substrate (14) with a flexible bag (22); evacuating the interior of the bag (22) and sintering the semiconductor device (12) and the substrate (14) together by applying heat and pressure to the layer (20). The heat and the pressure are applied by a gas (44) that surrounds the flexible bag (22) which encloses the semiconductor device (12) and the substrate (14).

Abstract translation: 将电子半导体器件（12）接合到衬底（14）的方法包括以下步骤：在半导体器件（12）和/或衬底（14）的接合区域上沉积金属颗粒层（20） ）; 将半导体器件（12）定位在衬底（14）上，使得层（20）位于半导体器件（12）和衬底（14）之间;封装半导体器件（12）和衬底（14） 具有柔性袋（22）; 通过向层（20）施加热和压力，抽空袋（22）的内部并将半导体器件（12）和衬底（14）烧结在一起。 热和压力通过围绕包围半导体器件（12）和衬底（14）的柔性袋（22）的气体（44）施加。