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    HIGH DENSITY DSX SYSTEM
    4.
    发明申请
    HIGH DENSITY DSX SYSTEM 审中-公开
    高密度DSX系统

    公开(公告)号：WO2004039094A3

    公开(公告)日：2004-08-05

    申请号：PCT/US0331996

    申请日：2003-10-08

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： BAKER SCOTT K ,  DEWEY JAMES D ,  LOUWAGIE DOMINIC J ,  CHOUANARD HARVEY J

    IPC: H01R24/58 ,  H04Q1/06 ,  H04Q1/14 ,  H01R13/00 ,  H05K7/18

    CPC classification number: H04Q1/142 ,  H04Q1/06 ,  H04Q1/062 ,  H04Q1/064 ,  H04Q1/09 ,  H04Q1/155 ,  H04Q2201/12 ,  H04Q2201/18

    Abstract: A DSX system (30) arranged to receive a plurality of high-density chassis (32) is disclosed. The chassis (32) include back planes (24) having rear access IN/OUT fields (42) and rear access cross-connect fields (40). The rear access fields are electrically connected to termination panels located in respective IN/OUT regions and cross-connect regions. Each of the regions includes cable management channels within which system cables are routed.

    Abstract translation: 公开了一种布置成接收多个高密度底盘（32）的DSX系统（30）。 底盘（32）包括具有后访问输入/输出字段（42）和后访问交叉连接字段（40）的后平面（24）。 后访问区域电连接到位于相应的IN / OUT区域和交叉连接区域中的终端面板。 每个区域都包括电缆管理通道，系统电缆在其中布线。

    ACTIVE SIGNAL CROSS-CONNECT SYSTEM
    5.
    发明申请
    ACTIVE SIGNAL CROSS-CONNECT SYSTEM 审中-公开
    有源信号交叉连接系统

    公开(公告)号：WO2008027562A3

    公开(公告)日：2008-05-15

    申请号：PCT/US2007019213

    申请日：2007-08-31

    Applicant: ADC TELECOMMUNICATIONS INC ,  TARI GABOR ,  BOKA FERENC ,  LOUWAGIE DOMINIC J ,  MEJIA DE AVILA ALEJANDRO ,  BALANDRAN LUIS LORENZO

    Inventor： TARI GABOR ,  BOKA FERENC ,  LOUWAGIE DOMINIC J ,  MEJIA DE AVILA ALEJANDRO ,  BALANDRAN LUIS LORENZO

    IPC: H04Q1/14

    CPC classification number: H04Q1/142 ,  H04Q1/06 ,  H04Q2201/02

    Abstract: A telecommunications system includes a chassis having a front side and a rear side and a plurality of jacks mounted to the chassis. Each jack includes an IN port, an OUT port and a MONITOR port. A cross-connect panel including an array of cross-connect connection locations is accessible from the front side of the chassis. An optical multiplexer housed within the chassis is electrically connected to the jacks by circuitry within the chassis. The multiplexer is configured to multiplex a plurality of IN electrical signals that are going away from the jacks toward a piece of telecommunications equipment to an IN optical signal and is configured to split an OUT optical signal that is going away from the piece of telecommunications equipment toward the jacks to a plurality of OUT electrical signals, wherein the IN electrical signals and the OUT electrical signals can be monitored by inserting plugs into the MONITOR ports of the jacks.

    Abstract translation: 电信系统包括具有前侧和后侧的底架以及安装到底架上的多个插座。 每个插孔都包含一个IN端口，一个OUT端口和一个MONITOR端口。 包括交叉连接位置阵列的交叉连接面板可从机箱的前侧接入。 安装在机箱内的光学多路复用器通过机箱内的电路电连接到插座。 多路复用器被配置为将远离插孔的多个IN电信号多路复用到一个电信设备到IN光信号，并且被配置为将远离该电信设备的OUT光信号分路到 插孔连接到多个OUT电信号，其中IN电信号和OUT电信号可通过将插头插入插孔的MONITOR端口来监测。

    REAR ACCESS DSX SYSTEM
    6.
    发明申请
    REAR ACCESS DSX SYSTEM 审中-公开
    后续DSX系统

    公开(公告)号：WO2004039095A3

    公开(公告)日：2004-08-12

    申请号：PCT/US0331997

    申请日：2003-10-08

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： BAKER SCOTT K ,  DEWEY JAMES D ,  LOUWAGIE DOMINIC J

    IPC: H01R13/00 ,  H01R24/58 ,  H01R29/00 ,  H02B1/056 ,  H04M1/00 ,  H04Q1/14 ,  H05K7/18

    CPC classification number: H04Q1/136 ,  H04Q2201/02 ,  H04Q2201/12

    Abstract: A DSX system (30) for receiving removable jack inserts (36, 38) is disclosed. The system includes a plurality of chassis rearward facing cross-connect arrays (40) and rearward facing IN/OUT arrays (42). A first circuit board section and a second circuit board section (120, 130) are electrically connected to the arrays. The first circuit board section is positioned behind the removable jack inserts (36, 38). The second circuit board section is positioned behind the first circuit board section and in front of the cross-connect array and the IN/OUT array.

    Abstract translation: 公开了一种用于接收可移动插座插入件（36,38）的DSX系统（30）。 该系统包括多个机架向后的交叉连接阵列（40）和面向后的IN / OUT阵列（42）。 第一电路板部分和第二电路板部分（120,130）电连接到阵列。 第一电路板部分位于可移动插座插入件（36,38）的后面。 第二电路板部分位于第一电路板部分的后面，并且位于交叉连接阵列和IN / OUT阵列的前面。

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