公开(公告)号：JP2005252273A

公开(公告)日：2005-09-15

申请号：JP2005076211

申请日：2005-03-17

Applicant: Ade Corp ,  エーディーイー コーポレーション

Inventor： ROBERT C ABE ,  PODUJE NOEL S ,  RANDALL K GOODALL ,  DOMENICALI PETER

IPC: H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a system that is improved to avoid the impairment or the contamination of a wafer when it is handled, processed, or measured.
SOLUTION: Vertical type wafer processed equipment is prepared, and only the edge of a wafer is brought into contact with it. If a wafer is handled vertically, air flows such that it vertically crosses it, and thus, contamination by minute particles partially decreases. The distortion of the wafer may be caused by its gravity when it is handled horizontally, but this can be decreased by handling the wafer vertically. If contact with the wafer is limited to its edge, potentially harmful influences by the contact such as contamination or a damage are conveniently decreased. Further, if the wafer is handled at its edge part, both sides of the wafer can be made to serve as an effective range for measurement.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种改进的系统，以避免在处理，处理或测量晶片时的损坏或污染。

解决方案：制备垂直型晶片加工设备，只有晶片的边缘与其接触。 如果晶片被垂直地处理，则空气流动使得其垂直地穿过它，因此微粒子的污染部分地减少。 当晶片处理水平时，晶片的变形可能由其重力引起，但是可以通过垂直处理晶片来降低晶片的变形。 如果与晶片的接触被限制在其边缘，则接触的潜在有害影响（例如污染或损坏）方便地降低。 此外，如果在其边缘部分处理晶片，则可以使晶片的两侧用作测量的有效范围。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JPH1070162A

公开(公告)日：1998-03-10

申请号：JP5684397

申请日：1997-02-25

Applicant: ADE CORP

Inventor： MALLORY ROY E ,  DOMENICALI PETER ,  PODUJE NOEL S ,  BELYAEV ALEXANDER ,  HARVEY PETER A ,  SMITH RICHARD S

IPC: H01L21/66 ,  H01L21/677 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To provide a high-speed and low-cost system for testing wafers and its automatic calibration system. SOLUTION: In an instrumentation station 118, a wafer 124 is rotated in its vertical plane and a scanning sensor is moved linearly along a parallel axis with the rotational plane of the wafer 124 to obtain thereby spiral and other scanning paths of the wafer 124 over its whole surface. By holding the wafer 124 vertically in this way, the errors caused by the originating deflection from the weight of the wafer itself, especially the large wafer (e.g. 300mm in diameter), are reduced. Further, in the instrumentation station 118, providing a plurality of wafer grippers, they are moved in the plane of the wafer 124 to fasten it to the grippers in predetermined places for its rotation. Also, in the instrumentation station 118, a plurality of master calibration gauges 212 are provided to simplify thereby the calibration of the testing system for wafers, making any wafer for calibration tests unnecessary. Digitizing early the obtained probe instrumentation data of the wafer 124, they are calibrated thereafter in a digital way to decode them again and perform their filterings and other processings.

公开(公告)号：JP2005167210A

公开(公告)日：2005-06-23

申请号：JP2004310386

申请日：2004-10-26

Applicant: Ade Corp ,  エーディーイー コーポレーション

Inventor： ROBERT C ABE ,  PODUJE NOEL S ,  RANDALL K GOODALL ,  DOMENICALI PETER

IPC: H01L21/66 ,  H01L21/677 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To enable overall observation of a fault in wafer processing, pairing up with a data network, and to prevent smearing by enabling the utilization of correction/measurement of a relationship between information on actual data and the simulation of wafer processing, prior to the offsetting of the processing beyond control or definite limitation. SOLUTION: The correction/measurement for wafer can be utilized for the relationship between the actual data and the processing simulation, prior to the offsetting of the processing beyond definite limitation. A vertical wafer processor is provided, in which a wafer is allowed to be contacted only at its edges. When a wafer is handled in a vertical manner, air flows vertically across the wafer to partially decrease smearing by fine particles. By handling a wafer in a vertical manner, strain due to the gravity that would have been caused by handling the wafer in a horizontal manner is decreased. Limitation of contact to an edge portion alone of a wafer decreases potentially harmful influence, such as smearing or breakage, that would be caused by contact. Further, by handling a wafer through its edge portion alone, both of the entire surfaces of the wafer can be the coverage of measurement. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了能够全面观察晶片处理中的故障，与数据网络配对，并且通过实现对实际数据的信息和模拟之间的关系的校正/测量的利用来防止拖尾 在处理偏移超出控制或明确限制之前的晶片处理。

解决方案：在处理偏移超出明确限制之前，可以将晶圆的校正/测量用于实际数据和处理模拟之间的关系。 提供了一种垂直晶片处理器，其中允许晶片仅在其边缘处被接触。 当以垂直方式处理晶片时，空气垂直流过晶片，以部分地减少细颗粒的拖尾。 通过以垂直方式处理晶片，减少了由于以水平方式处理晶片而引起的重力引起的应变。 与晶片单独的边缘部分接触的限制减少了由接触引起的潜在的有害影响，如拖尾或断裂。 此外，通过仅通过其边缘部分处理晶片，晶片的整个表面都可以是测量的覆盖范围。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002151562A

公开(公告)日：2002-05-24

申请号：JP2001230899

申请日：2001-07-31

Applicant: ADE CORP

Inventor： ROBERT C ABE ,  PODUJE NOEL S ,  RANDALL K GOODALL ,  DOMENICALI PETER

IPC: H01L21/66 ,  H01L21/677 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To prevent contamination and damage on a wafer in a measuring station and measuring stations. SOLUTION: Wafers 22a-n are stored in cassettes 24a-g in input and output transfer to and from the measuring station 12. The cassettes 24a-g have plural trenches having the form and dimension for maintaining the wafers 22a-n substantially in the vertical direction, and the bottoms are opened in order to facilitate vertical transfer of the wafers 22a-n. In the measuring station 12, the wafer 22f is treated while being maintained vertically. By the vertical type wafer treating equipment, contact is performed only with the edge of a wafer, so that air flows intersecting the wafer vertically and contamination caused by fine particles is reduced. Distortion of a wafer which is caused by the influence of gravity in the case of horizontal treatment is reduced by the vertical treatment. By limiting the contact with the edge, contamination and damage can be reduced. By handling the edge, the whole of both surfaces of a wafer is made an effective range of measurement.