Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive composition showing excellent heat resistance and chemical resistance after subjected to high temperature thermal history and having little film reduction during development and a large development margin in a developing process.SOLUTION: The positive photosensitive composition includes: (A) a silanol group-containing polysiloxane compound comprising a structure obtained by a hydrolysis and condensation reaction of a compound expressed by formula (1) with a compound expressed by formula (2); (B) a compound having at least two epoxy-containing organic groups; (C) diazonaphthoquinones; and (D) an organic solvent. In formula (1), Rrepresents an alkyl group having 1 to 4 carbon atoms, or the like; Rrepresents a divalent hydrocarbon group having 2 to 10 carbon atoms; Rrepresents a divalent saturated aliphatic hydrocarbon group having 2 to 10 carbon atoms; and X represents a group expressed by a specified general formula.
Abstract translation:要解决的问题:提供一种在经历高温热历史之后显示出优异的耐热性和耐化学性,并且在显影过程中几乎没有膜还原和在显影过程中具有大的显影余量的正性光敏组合物。 正光敏组合物包括:(A)含有通过式(1)表示的化合物与式(2)表示的化合物的水解和缩合反应获得的结构的含硅烷醇基的聚硅氧烷化合物; (B)具有至少两个含环氧基的有机基团的化合物; (C)重氮萘醌; 和(D)有机溶剂。 式(1)中,R 1表示碳原子数1〜4的烷基等, R 2表示具有2〜10个碳原子的二价烃基; R 2表示碳原子数2〜10的二价饱和脂肪族烃基, X表示由规定的通式表示的基团。 版权所有(C)2013,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which is excellent in transparency and provides a permanent resist having such high heat resistance and chemical resistance after high-heat history that it is also used as an insulating film above an active matrix substrate, a permanent resist using the positive photosensitive composition and a method for producing the same. SOLUTION: The positive photosensitive composition includes (A) a silicone resin having at least two groups per molecule represented by general formula (1) (wherein, R 1 denotes a 1-10C alkylene group which may have a substituted hydrocarbon group, R 2 denotes a 1-4C alkyl group, a denotes an integer of 0 or 1-4, b denotes an integer of 1-3, and a+b does not exceed 5), (B) a siloxane compound having a glycidyl group, (C) diazonaphthoquinones and (D) an organic solvent. The permanent resist is produced by applying the positive photosensitive composition on a substrate and subjecting the resulting coating to exposure, alkali development and post-bake at 120-350°C. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition suitable for the formation of an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance and a low dielectric constant, and having a large development margin that allows formation of a favorable pattern even when a developing time exceeds the optimal developing time in a developing process.SOLUTION: A positive photosensitive resin composition contains a polysiloxane compound having a carboxyl group and/or a phenolic hydroxyl group as a base resin, a photosensitive diazoquinone compound as a photosensitive component, and an organic solvent, into which an epoxy siloxane compound is incorporated. The epoxy siloxane compound comprises groups of a cyclic siloxane structure having an epoxy group connected via a residue of a compound having 2 to 4 vinyl groups per molecular from which the vinyl groups are removed.
Abstract:
PROBLEM TO BE SOLVED: To provide a cell culture substrate having high cellular adhesiveness, enabling normal-temperature preservation and long-term preservation, and fine processing in a micro- or nano-scale. SOLUTION: The cell culture substrate has a silicone resin having a group represented by general formula (1) and/or a group represented by general formula (2) and formed on the surface. In the formulas, R 1 is 1-10C alkylene which may have substituted hydrocarbon; R 2 is 1-4C alkyl; (a) is a number of 0 or 1-4; (b) is a number of 1-3, with the proviso that (a+b) does not exceed 5; R 3 is 1-10C alkylene which may have substituted hydrocarbon; R 4 is 1-4C alkyl; (c) is a number of 0 or 1-4; and (d) is a number of 1-3, with the proviso that (c+d) does not exceed 5. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation:要解决的问题:提供具有高细胞粘附性,能够进行常温保存和长期保存的细胞培养基质,以及微米级或纳米级的精细加工。 解决方案:细胞培养基底具有由通式(1)表示的基团和/或由通式(2)表示的基团的表面形成的基团的有机硅树脂。 在式中,R 1是具有取代烃的1-10C亚烷基; R 2是1-4C烷基; (a)是0或1-4的数字; (b)为1-3,条件是(a + b)不超过5; R 3是具有取代烃的1-10C亚烷基; R 4是烷基; (c)是0或1-4的数; (d)为1-3,条件是(c + d)不超过5.版权所有(C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a curable composition capable of obtaining the corresponding cured product with hardness and adhesiveness, and supressed in development of debonding and cracks even if heated to 260°C as a lead-free solder reflow temperature, thus maintaining its own adhesiveness.SOLUTION: A curable composition comprises: (A) a siloxane compound having in the molecule at least three SiH groups; (B) a siloxane compound having in the molecule at least two alkenyl groups reactive with SiH group; and (C) a hydrosilylating catalyst. In this curable composition, the molar ratio of the SiH groups to the alkenyl groups reactive with the SiH groups is 2-15; and the excess amount of the content of the SiH groups based on that of the alkenyl groups reactive with the SiH groups is at least 2 mmol/g.
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which can provide a permanent resist which is excellent in terms of transparency, can also be used as an insulating film of an active matrix substrate and has high heat resistance and chemical resistance after high heat history and to provide a permanent resist using the positive photosensitive composition and a method for manufacturing the permanent resist.SOLUTION: A positive photosensitive composition includes as (A) component polysiloxane compound obtained by hydrolysis and condensation of a predetermined cyclic siloxane compound and a predetermined alkoxysilane compound such that silanol groups remain, as (B) component a compound with at least two epoxy groups, as (C) component diazonaphthoquinones and as (D) component an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition, which is suitable for the formation of an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance and a low dielectric constant, and which has a large development margin capable of forming a favorable pattern even over the optimal developing time.SOLUTION: The positive photosensitive composition comprises a polysiloxane compound obtained by hydrolysis condensation of a compound (1) and a compound (2) of the formulae, a photoacid generator and an organic solvent. In the formulae, Rrepresents a 1-4C alkyl group or a 6-10C aryl group; Rrepresents a 2-10C divalent hydrocarbon group; Rrepresents a 2-10C divalent saturated aliphatic hydrocarbon group; and Xand Xrepresent an acid dissociable dissolution inhibiting group.
Abstract translation:要解决的问题:提供一种正型感光性树脂组合物,其适于形成具有高耐热性,高耐溶剂性,高透射率和低介电常数的层间绝缘膜,并且具有大的显影性 即使在最佳开发时间内,边缘也能形成有利的格局。 解决方案:正型光敏组合物包含通过化合物(1)和式(2)的化合物(2),光酸产生剂和有机溶剂的水解缩合得到的聚硅氧烷化合物。 在该式中,R 1表示1-4C烷基或6-10C芳基; R 2 SP>表示2-10C二价烃基; R 3 SP>表示2-10C二价饱和脂族烃基; 并且X 1 SP>和X 2 SP>表示酸解离溶解抑制基团。 版权所有(C)2013,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition suitable for the formation of an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance and a low dielectric constant, and having a large development margin that allows formation of a favorable pattern even when a developing time exceeds the optimal developing time in a developing process.SOLUTION: A positive photosensitive resin composition contains: a polysiloxane compound having a carboxyl group and/or a phenolic hydroxyl group as a base resin; a photosensitive diazoquinone compound as a photosensitive component; an organic solvent; and a hydrolyzed condensate of an alkyl silane compound expressed by a general formula (1) and an aryl silane compound expressed by a general formula (2).