公开(公告)号：US11905404B2

公开(公告)日：2024-02-20

申请号：US17254587

申请日：2019-06-27

Applicant: ADEKA CORPORATION

Inventor： Masato Inadome ,  Naohiro Fujita ,  Kazuhide Morino ,  Chihiro Asakura

IPC: C08L63/00 ,  C07F9/54 ,  C08J5/04 ,  C08L79/04 ,  C08J5/24

CPC classification number: C08L63/00 ,  C07F9/5463 ,  C08J5/042 ,  C08J5/243 ,  C08J5/249 ,  C08L79/04 ,  C08J2363/00 ,  C08J2379/04 ,  C08J2463/00 ,  C08J2479/04

Abstract: Provided is a resin composition that is capable of producing a cured product having excellent environmental suitability, high strength, and excellent flame retardancy, and that is suitably usable as a matrix resin for fiber-reinforced plastics. A resin composition contains (A) an epoxy resin, (B) a cyanate resin, (C) an aromatic amine curing agent that is liquid at 25° C., and (D) a phosphorus-containing compound represented by formula (1). Preferably, in formula (1), R1 and R2 each independently represent an alkyl group or an aryl group, and X and Y are an oxygen atom.

公开(公告)号：US12172389B2

公开(公告)日：2024-12-24

申请号：US15777032

申请日：2016-11-21

Applicant: ADEKA CORPORATION

Inventor： Naohiro Fujita ,  Kazuhide Morino ,  Masato Inadome ,  Masayoshi Goke ,  Takeshi Sukemune ,  Yosuke Aragane ,  Tomo Kimura ,  Akinori Okubo

IPC: B29C70/34 ,  B29C70/06 ,  B29C70/38 ,  B29C70/56 ,  C08J5/04 ,  B29K63/00 ,  B29K105/00

Abstract: A molding apparatus reduces waviness or deformation of fibers. The molding apparatus includes a fiber feeder (7) that feeds fibers (5) to a lamination area (32) long in a first direction, a resin composition feeder (11) that feeds a resin composition (9) to the lamination area (32), an impregnator (17) that impregnates the fibers (5) fed to the lamination area (32) with the resin composition (9), a curing accelerator (13) that accelerates curing of the resin composition (9) fed to the lamination area (32) while the fibers (5) fed in the lamination area (32) are being tensioned, and a transporter (15) that relatively moves the devices (7, 11, 17, and 13) in the first direction with respect to the lamination area (32). The resin composition (9) contains an epoxy resin (A), a cyanate resin (B), and an aromatic amine curing agent (C) that is liquid at 25° C.

公开(公告)号：US11649319B2

公开(公告)日：2023-05-16

申请号：US16477471

申请日：2018-02-26

Applicant: ADEKA CORPORATION

Inventor： Masato Inadome ,  Naohiro Fujita ,  Kazuhide Morino

IPC: C08J5/24 ,  B32B27/26 ,  B32B27/38 ,  C08L63/00 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08K7/14

CPC classification number: C08G59/56 ,  C08K7/14

Abstract: The present invention provides a resin composition for a fiber-reinforced plastic, the resin composition including a cyanate ester (A), an epoxy resin (B), and an aromatic amine-based curing agent that is liquid at 25° C. (C), wherein the average number of cyanate groups in the cyanate ester (A) is 2.1 or greater, and/or the average number of epoxy groups in the epoxy resin (B) is 2.1 or greater. A fiber-reinforced plastic that is produced using this composition and a reinforcing fiber has favorable heat resistance and excellent tensile and bending properties, and therefore can be applied to a wide variety of fields including transport vehicles such as ships, automobiles, and aircrafts, sporting goods, building materials such as sinks and window frames, as well as industrial machinery and materials such as high-pressure gas tanks and blades for wind power generation.

公开(公告)号：US10557002B2

公开(公告)日：2020-02-11

申请号：US15757086

申请日：2016-08-25

Applicant: ADEKA CORPORATION

Inventor： Naohiro Fujita ,  Kazuhide Morino ,  Tasuku Aoki ,  Tomoko Kimura ,  Masato Inadome

IPC: B32B27/38 ,  B32B27/26 ,  C08G59/22 ,  C08G59/24 ,  C08G59/50 ,  C08L63/00 ,  C08J5/24 ,  C08J5/04 ,  C08G59/40 ,  C08J3/28

Abstract: A resin composition for fiber reinforced plastic which is a resin composition comprising an epoxy resin (A), a cyanate resin (B) and a liquid aromatic amine curing agent (C), and, as necessary, further an active energy radiation absorbable component (D), wherein 20 to 100 percent by mass of the aforementioned epoxy resin (A) is an epoxy compound expressed by the following general formula (1), a cured product obtained by curing a composition containing said resin composition and a high-strength fiber-reinforced plastic; wherein (a) and (b) each independently express an integer from 2 to 10, (c) expresses an integer from 0 to 3, R1 and R2 each independently express a bivalent hydrocarbon group having 2 to 5 carbon atoms, and R3 expresses a single bond, a methylene group or —C(CH3)2—.