公开(公告)号：US12172389B2

公开(公告)日：2024-12-24

申请号：US15777032

申请日：2016-11-21

Applicant: ADEKA CORPORATION

Inventor： Naohiro Fujita ,  Kazuhide Morino ,  Masato Inadome ,  Masayoshi Goke ,  Takeshi Sukemune ,  Yosuke Aragane ,  Tomo Kimura ,  Akinori Okubo

IPC: B29C70/34 ,  B29C70/06 ,  B29C70/38 ,  B29C70/56 ,  C08J5/04 ,  B29K63/00 ,  B29K105/00

Abstract: A molding apparatus reduces waviness or deformation of fibers. The molding apparatus includes a fiber feeder (7) that feeds fibers (5) to a lamination area (32) long in a first direction, a resin composition feeder (11) that feeds a resin composition (9) to the lamination area (32), an impregnator (17) that impregnates the fibers (5) fed to the lamination area (32) with the resin composition (9), a curing accelerator (13) that accelerates curing of the resin composition (9) fed to the lamination area (32) while the fibers (5) fed in the lamination area (32) are being tensioned, and a transporter (15) that relatively moves the devices (7, 11, 17, and 13) in the first direction with respect to the lamination area (32). The resin composition (9) contains an epoxy resin (A), a cyanate resin (B), and an aromatic amine curing agent (C) that is liquid at 25° C.