公开(公告)号：EP2600700A1

公开(公告)日：2013-06-05

申请号：EP11401654.6

申请日：2011-12-02

Applicant: ADVA Optical Networking SE

Inventor： Wald, Toni ,  Liborius, Sven

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0209 ,  H05K1/0207 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10204

Abstract: The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.

Abstract translation: 本发明涉及一种使用表面贴装装置（SMD）冷却电子电路板的方法，所述方法包括以下步骤：在板布局之后或期间，填充空空间V1，V2，V3，V4，V5，V6，V7， V8，V9，V10，其中多个散热装置1,2,3,4,5在热热点附近并将多个散热装置1,2,3,4,5连接到导热路径25 ，N号分别为27,29,31,33,35。 此外，本发明涉及适于实现根据本发明的方法的散热设备1,2,3,4,5。