公开(公告)号：WO1998056032A1

公开(公告)日：1998-12-10

申请号：PCT/US1997020192

申请日：1997-11-06

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： ADVANCED MICRO DEVICES, INC. ,  PAKERIASAMY, Saragarvani

IPC: H01L21/00

CPC classification number: H01L21/67333 ,  H01L2221/68313

Abstract: A mu BGA carrier for packing and shipping of a plurality of mu BGA packages is specially adapted for facilitating the inspection of the solder balls on the bottom surfaces of the mu BGA packages. The carrier consists of a tray member (12) having a plurality of first pockets (28) disposed therein for packing and storing the plurality of mu BGA packages, and a lid member (14) having a plurality of second pockets (40) formed therein. The second pockets are vertically aligned with corresponding ones of the plurality of first pockets in the tray member when the lid member is placed on top of the tray member. The carrier can be flipped upside-down so that when the tray member is removed the solder balls are facing upwardly to allow inspection of the same.

Abstract translation: 用于包装和运送多个mu BGA封装的mu BGA载体特别适用于便于对mu BGA封装的底表面上的焊球进行检查。 托架包括一个托盘构件（12），该托盘构件具有多个设置在其中的第一凹穴（28），用于堆放和储存多个mu BGA封装;以及盖构件（14），其具有形成在其中的多个第二凹穴（40） 。 当盖构件放置在托盘构件的顶部上时，第二袋与托盘构件中的多个第一袋中的相应的袋垂直对准。 载体可以颠倒翻转，使得当托盘构件被移除时，焊球面向上以允许对其进行检查。