公开(公告)号：AU8117801A

公开(公告)日：2002-03-04

申请号：AU8117801

申请日：2001-08-07

Applicant: ADVANCED MICRO DEVICES INC

Inventor： MASTER RAJ N ,  KHAN MOHAMMAD Z ,  GUARDADO MARIA G ,  ONG OOI TONG

IPC: B23K1/20 ,  H05K3/34

Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

公开(公告)号：WO0216068A3

公开(公告)日：2002-06-06

申请号：PCT/US0124843

申请日：2001-08-07

Applicant: ADVANCED MICRO DEVICES INC

Inventor： MASTER RAJ N ,  KHAN MOHAMMAD Z ,  GUARDADO MARIA G ,  ONG OOI TONG

IPC: B23K1/20 ,  H05K3/34

CPC classification number: H05K3/3489 ,  B23K1/203 ,  B23K2201/36 ,  H05K3/3436

Abstract: A method and apparatus are provided for controllably dispensing flux (30) on a substrate (26) having a plurality of conductive terminals (12A, 12B, 20). Flux (30) having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate (26) and the conductive terminals (12A, 12B, 20) at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser (22). Upon a subsequent high temperature solder reflow process, the sprayed flux (30) on the substrate (26) is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate (26) between the conductive terminals (12A, 12B, 30).

Abstract translation: 提供了一种用于在具有多个导电端子（12A，12B，20）的基板（26）上可控地分配助熔剂（30）的方法和装置。 具有介于10厘泊与约150厘泊之间粘度范围的通量（30）经由分配在约1.5psi与约30psi之间的阀压力范围喷射到基板（26）和导电端子（12A，12B，20） 通量分配器（22）的喷嘴。 在随后的高温回流焊过程中，基板（26）上的喷射通量（30）大部分通过热分解除去至挥发性物质上，从而显着减少残留在基板（26）的表面上的导电端子 （12A，12B，30）。