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1.发明公开COMPOSITIONS AND METHODS FOR DRYING PATTERNED WAFERS DURING MANUFACTURE OF INTEGRATED CIRCUITRY PRODUCTS 审中-公开ZUSAMMENSETZUNGEN UND VERFAHREN ZUM TROCKNEN VON STRUKTURIERTEN WAFERN贝德尔海斯特赖恩VON INTEGRIERTEN SCHALTUNGSPRODUKTEN
公开(公告)号：EP1765526A4
公开(公告)日：2007-11-14
申请号：EP04751653
申请日：2004-05-07
Applicant: ADVANCED TECH MATERIALS
Inventor： XU CHONGYING , KORZENSKI MICHAEL , BAUM THOMAS H , BOROVIK ALEXANDER , GHENCIU ELIODOR G
CPC classification number: B08B7/0021
Abstract: Drying of patterned wafers is achieved in a manner effecting removal of water from the patterned wafers without collapse or deterioration of the pattern structures thereof. The drying is carried out in one aspect of the invention with a composition containing supercritical fluid, and at least one water-reactive agent that chemically reacts with water to form reaction product(s) more soluble in the supercritical fluid than water. Various methodologies are described for use of supercritical fluids to dry patterned wafers, which avoid the (low water solubility) deficiency of supercritical fluids such as supercritical CO2.
Abstract translation: 图案化晶片的干燥以实现从图案化晶片中除去水而不塌陷或其图案结构劣化的方式来实现。 在本发明的一个方面中，用含有超临界流体和至少一种水反应剂的组合物进行干燥，所述水反应剂与水化学反应形成比水更易溶于超临界流体的反应产物。 描述了使用超临界流体来干燥图案化晶片的各种方法，其避免超临界流体（例如超临界二氧化碳）的（低水溶性）缺乏。
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2.发明公开COPPER (I) COMPOUNDS USEFUL AS DEPOSITION PRECURSORS OF COPPER THIN FILMS 审中-公开至于铜薄膜合适的铜（I）化合物的分离前兆
公开(公告)号：EP1765834A4
公开(公告)日：2010-10-06
申请号：EP05725521
申请日：2005-03-14
Applicant: ADVANCED TECH MATERIALS
Inventor： XU CHONGYING , BOROVIK ALEXANDER , BAUM THOMAS H
IPC: C07F1/00 , C07C257/14 , C07F1/08 , C23C16/00 , C23C16/18
CPC classification number: C07C257/14 , C07F1/005 , C23C16/18
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