公开(公告)号：SG158920A1

公开(公告)日：2010-02-26

申请号：SG2010005627

申请日：2006-01-26

Applicant: ADVANCED TECH MATERIALS

Inventor： WALKER ELIZABETH ,  NAGHSHINEH SHAHRI ,  BARNES JEFFREY A ,  OLDAK EWA ,  PETERS DARRYL W ,  YANDERS KEVIN P

Abstract: COMPOSITIONS FOR PROCESSING OF SEMICONDUTOR SUBSTRATES Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of microelectronic device wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation- resistant in exposure to oxygen. Fig. 27A & 27B

公开(公告)号：SG162725A1

公开(公告)日：2010-07-29

申请号：SG2010036705

申请日：2006-05-25

Applicant: ADVANCED TECH MATERIALS

Inventor： BARNES JEFFREY ,  WALKER ELIZABETH ,  PETERS DARRYL W ,  BARTOSH KYLE ,  OLDAK EWA ,  YANDERS KEVIN P

Abstract: Alkaline aqueous cleaning compositions and processes for cleaning post- chemical mechanical polishing (CMP) residue, post-etch residue and/or contaminants from a microelectronic device having said residue and contaminants thereon. The alkaline aqueous cleaning compositions include amine, passivating agent, and water. The composition achieves highly efficacious cleaning of the residue and contaminant material from the microelectronic device while simultaneously passivating the metal interconnect material.

公开(公告)号：EP1851296A4

公开(公告)日：2011-01-19

申请号：EP06719661

申请日：2006-01-26

Applicant: ADVANCED TECH MATERIALS

Inventor： WALKER ELIZABETH ,  NAGHSHINEH SHAHRI ,  BARNES JEFFREY A ,  OLDAK EWA ,  PETERS DARRYL W ,  YANDERS KEVIN P

IPC: C11D7/32 ,  C11D7/26 ,  C11D11/00 ,  H01L21/02 ,  H01L21/461

CPC classification number: H01L21/02071 ,  C11D7/06 ,  C11D7/26 ,  C11D7/264 ,  C11D7/265 ,  C11D7/32 ,  C11D7/3218 ,  C11D11/0047 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/02074