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    Contact devices
    1.
    发明授权
    Contact devices 失效
    联系设备

    公开(公告)号：US3287037A

    公开(公告)日：1966-11-22

    申请号：US41896764

    申请日：1964-12-17

    Applicant: AGA AB

    Inventor： JOEL AVERSTEN KARL

    IPC: B23K9/028 ,  H01R4/02

    CPC classification number: H01R4/02 ,  B23K9/0288 ,  B23K2201/38 ,  Y10T403/479

    Abstract: 1,070,559. Soldering. AGA A.B. Dec. 10, 1964 [Jan. 10, 1964], No. 50283/64. Heading B3R. In soldering a contact shoe and its contained cable end to a metal surface wherein a metal stud having solder at its end is soldered into an aperture in the shoe and to the metal surface by striking an arc between the surface and the solder on the stud and forcing the stud into the solder melted into the aperture, the contact shoe and its contained cable end is proportioned to have a minimum volume W min and a maximum volume W max according to the formulµ wherein W = volume of contact end of the cable shoe and its contained cable end in cm. 3 A = cross sectional area of the solder on the stud in cm. 2 h = height of the solder on the stud in cm. K = melting temperature of the solder in kelvin degrees K 1 = melting temperature of contact shoe and metal in kelvin degrees k = constant lying between 0À2 and 0À26 depending on the solder used. The metal stud (4), Fig. 4 (not shown), is of brass with an end portion (5) of silver solder of Cu 19%; Zn 13-17%; Ag 42-46%; Cd 18-22% for which K = 0À2 and has a notched portion to facilitate breaking-off a -portion after soldering. The contact shoe is circular and is provided on the end of a cable (1) to be soldered to a rail (3). Other solders which may be used comprise Cu 16%; Zn 23%; Ag 49%; Mn 7% and Ni 5%, for which K = 0À2, Cu 50%; Zn 31%; Ag 12% and Cd 7% for which k = 0À22 and Cu 86%; Mn 10% and Co 4% for which k = 0À26.

    Abstract translation: 1,070,559。 焊接。 AGA A.B. 1964年12月10日[1月 10，1964]，No.50283/64。 标题B3R。 在将接触靴及其包含的电缆端焊接到金属表面上时，其端部具有焊料的金属螺柱通过在螺柱上的表面和焊料之间触发电弧而被焊接到焊盘中的孔中和金属表面，以及 迫使螺柱熔化到孔中的焊料中，接触靴及其包含的电缆端部成比例地具有根据配方的最小体积W min和最大体积W max，其中W =电缆靴的接触端的体积和 其包含的电缆端部以厘米为单位。 3 A =螺柱上焊料的横截面积，单位为cm。 2 h =螺柱上焊料的高度，单位为cm。 K =焊料的熔融温度，开氏度K 1 =接触靴和金属的熔融温度，开尔文度k = 0-2和0〜26之间的常数，这取决于所使用的焊料。 金属螺柱（4），图 图4（未示出）是具有Cu 19％的银焊料的端部（5）的黄铜。 锌13-17％; Ag 42-46％; Cd 18-22％，K = 0-2，并具有切口部分，以便在焊接之后破坏部分。 接触靴是圆形的，并且设置在待焊接到轨道（3）的电缆（1）的端部上。 可以使用的其他焊料包括Cu 16％; 锌23％; Ag 49％; Mn为7％，Ni为5％，K = 0〜2，Cu为50％。 Zn 31％; Ag 12％和Cd 7％，其中k = 0〜22和Cu 86％; Mn为10％，Co为4％，k = 0〜26。

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