1.
    发明专利
    未知

    公开(公告)号:DE10122133B4

    公开(公告)日:2004-01-08

    申请号:DE10122133

    申请日:2001-05-08

    Abstract: A microfluidic component having a microfluidic channel is bonded to an electronics component having a circuit for processing signals related to the microfluidic component. In an embodiment, the electronics component is a prefabricated integrated circuit chip that includes signal processing and/or process control functionality. The bonding of the microfluidic component to the electronics component provides a modular architecture in which different combinations of microfluidic components and electronics components can be used to create customized processing and analysis tools.

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