Polymer-graphene electronic component housing

    公开(公告)号:US12185515B2

    公开(公告)日:2024-12-31

    申请号:US17874938

    申请日:2022-07-27

    Abstract: An electronic component housing defining an EMI shield and an ESD protection cover includes a polymeric core formed from a first polymeric material with a reinforcement material and an overmolded outer layer formed from a second polymeric material with between about 2 wt. % and about 30 wt. % graphene. The reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defines a housing skin disposed on the polymeric core.

    POLYMER-GRAPHENE ENERGY ABSORBING COMPOSITE STRUCTURES AND METHODS OF MANUFACTURE

    公开(公告)号:US20230091672A1

    公开(公告)日:2023-03-23

    申请号:US17481732

    申请日:2021-09-22

    Abstract: A composite structure includes a foam core formed from a first polymer and between about 0.5 wt. % and about 2.5 wt. % graphene. The foam core has an average pore size between about 25 μm and about 75 μm, and a cell density between about 4×106 cells/mm2 and about 6×106 cells/mm2. Also, an overmolded skin formed from a second polymer and between about 0.25 wt. % and about 5.0 wt. % graphene is disposed on the foam core. A method of manufacturing a composite structure includes injection molding a foam core from a first polymer containing between about 0.25 wt. % and about 5.0 wt. % graphene, and injection molding an overmolded skin from a second polymer containing graphene between about 0.25 wt. % and about 5.0 wt. % graphene.

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