公开(公告)号：AU5485400A

公开(公告)日：2001-01-02

申请号：AU5485400

申请日：2000-06-14

Applicant: ALLIED SIGNAL INC

Inventor： SMITH GORDON ,  GOTRO JEFFREY T ,  HEIN MARC ,  ANDROFF NANCY M W

IPC: H05K1/09 ,  B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42

Abstract: This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using the substrates to manufacture laminates, circuits, interposers, and other electronic laminates.

公开(公告)号：CA2374863A1

公开(公告)日：2000-12-21

申请号：CA2374863

申请日：2000-06-14

Applicant: ALLIED SIGNAL INC

Inventor： GOTRO JEFFREY T ,  HEIN MARC ,  ANDROFF NANCY M W ,  SMITH GORDON

IPC: H05K1/09 ,  B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42

Abstract: This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using t he substrates to manufacture laminates, circuits, interposers, and other electronic laminates.