公开(公告)号：WO0007219A3

公开(公告)日：2000-05-11

申请号：PCT/US9916803

申请日：1999-07-22

Applicant: ALLIED SIGNAL INC

Inventor： POMMER RICHARD J ,  GOTRO JEFFREY T ,  ANDROFF NANCY M W ,  HEIN MARC D ,  ZARECKI COREY J

IPC: H05K1/09 ,  H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/02 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/022 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K3/388 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.

Abstract translation: 本发明是用于提供电基板的方法和设备。 电基片包括具有不大于6.0微米的表面粗糙度的电介质层。 第一导电层附着到介电层。 在一个实施例中，介电层包括叠层，其包括具有均匀编织的织物和始终浸渍在均匀编织内的树脂。 在金属化第一导电层之前，可以将可去除层附着到叠层并去除。 描述了各种实施例。

公开(公告)号：AU5127499A

公开(公告)日：2000-02-21

申请号：AU5127499

申请日：1999-07-22

Applicant: ALLIED SIGNAL INC

Inventor： POMMER RICHARD J ,  GOTRO JEFFREY T ,  ANDROFF NANCY M W ,  HEIN MARC D ,  ZARECKI COREY J

IPC: H05K1/09 ,  H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/02 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38

Abstract: The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.

公开(公告)号：AU5485400A

公开(公告)日：2001-01-02

申请号：AU5485400

申请日：2000-06-14

Applicant: ALLIED SIGNAL INC

Inventor： SMITH GORDON ,  GOTRO JEFFREY T ,  HEIN MARC ,  ANDROFF NANCY M W

IPC: H05K1/09 ,  B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42

Abstract: This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using the substrates to manufacture laminates, circuits, interposers, and other electronic laminates.

公开(公告)号：CA2374863A1

公开(公告)日：2000-12-21

申请号：CA2374863

申请日：2000-06-14

Applicant: ALLIED SIGNAL INC

Inventor： GOTRO JEFFREY T ,  HEIN MARC ,  ANDROFF NANCY M W ,  SMITH GORDON

IPC: H05K1/09 ,  B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42

Abstract: This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using t he substrates to manufacture laminates, circuits, interposers, and other electronic laminates.