公开(公告)号：WO0007219A3

公开(公告)日：2000-05-11

申请号：PCT/US9916803

申请日：1999-07-22

Applicant: ALLIED SIGNAL INC

Inventor： POMMER RICHARD J ,  GOTRO JEFFREY T ,  ANDROFF NANCY M W ,  HEIN MARC D ,  ZARECKI COREY J

IPC: H05K1/09 ,  H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/02 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/022 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K3/388 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.

Abstract translation: 本发明是用于提供电基板的方法和设备。 电基片包括具有不大于6.0微米的表面粗糙度的电介质层。 第一导电层附着到介电层。 在一个实施例中，介电层包括叠层，其包括具有均匀编织的织物和始终浸渍在均匀编织内的树脂。 在金属化第一导电层之前，可以将可去除层附着到叠层并去除。 描述了各种实施例。

公开(公告)号：AU5127499A

公开(公告)日：2000-02-21

申请号：AU5127499

申请日：1999-07-22

Applicant: ALLIED SIGNAL INC

Inventor： POMMER RICHARD J ,  GOTRO JEFFREY T ,  ANDROFF NANCY M W ,  HEIN MARC D ,  ZARECKI COREY J

IPC: H05K1/09 ,  H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/02 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38

Abstract: The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.