公开(公告)号：WO1997001593A1

公开(公告)日：1997-01-16

申请号：PCT/US1996010811

申请日：1996-06-25

Applicant: ALLIEDSIGNAL INC.

Inventor： ALLIEDSIGNAL INC. ,  LAU, Kreisler ,  HENDRICKS, Neil ,  WAN, William ,  SMITH, Aaron

IPC: C08G65/40

CPC classification number: H01L23/5329 ,  C08G65/4006 ,  C08G2650/48 ,  C08G2650/60 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/3154 ,  H01L2924/00

Abstract: A method is disclosed for making hydroxy-substituted ethynylated biphenyl compounds and for reacting such compounds with a family of noncross-linking thermosetting poly(arylene ethers) to produce novel poly(arylene ether) compositions which, when cured at glass transition temperatures greater than about 350 DEG C to form thin films, possess properties such as low dielectric constant, low moisture absorption, and high thermal stability. These films are suitable for use as intermetal dielectrics for multilevel interconnection.

Abstract translation: 公开了一种用于制备羟基取代的乙炔化联苯化合物的方法，并使这些化合物与非交联的热固性聚（亚芳基醚）家族反应以产生新的聚（亚芳基醚）组合物，其在玻璃化转变温度大于约 350℃，形成薄膜，具有低介电常数，低吸湿性，高热稳定性等特性。 这些膜适用于多层互连的金属间电介质。

公开(公告)号：WO1997001594A1

公开(公告)日：1997-01-16

申请号：PCT/US1996010812

申请日：1996-06-25

Applicant: ALLIEDSIGNAL INC.

Inventor： ALLIEDSIGNAL INC. ,  LAU, Kreisler ,  HENDRICKS, Neil ,  WAN, William ,  SMITH, Aaron

IPC: C08G65/40

CPC classification number: C08G65/4006 ,  C08G2650/48 ,  C08G2650/60 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method is disclosed for making hydroxy-substituted ethynylated biphenyl compounds and for reacting such compounds with a family of noncross-linking thermosetting poly(arylene ethers) to produce novel poly(arylene ether) compositions which, when cured at glass transition temperatures greater than about 350 DEG C to form thin films, possess properties such as low dielectric constant, low moistures absorption, and high thermal stability. These films are suitable for use as intermetal dielectrics for multilevel interconnection.

Abstract translation: 公开了一种用于制备羟基取代的乙炔化联苯化合物的方法，并使这些化合物与非交联的热固性聚（亚芳基醚）家族反应以产生新的聚（亚芳基醚）组合物，其在玻璃化转变温度大于约 350℃，形成薄膜，具有低介电常数，低吸湿性和高热稳定性等特性。 这些膜适用于多层互连的金属间电介质。

公开(公告)号：EP0835275B1

公开(公告)日：2002-04-03

申请号：EP96922563.0

申请日：1996-06-25

Applicant: AlliedSignal Inc.

Inventor： LAU, Kreisler ,  HENDRICKS, Neil ,  WAN, William ,  SMITH, Aaron

IPC: C08G65/40 ,  H01L23/29 ,  H01L23/498 ,  H01L23/532 ,  C07C39/21 ,  C08L71/00

CPC classification number: H01L23/5329 ,  C08G65/4006 ,  C08G2650/48 ,  C08G2650/60 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/3154 ,  H01L2924/00

公开(公告)号：EP0835274B1

公开(公告)日：2000-04-26

申请号：EP96921763.7

申请日：1996-06-25

Applicant: AlliedSignal Inc.

Inventor： LAU, Kreisler ,  HENDRICKS, Neil ,  WAN, William ,  SMITH, Aaron

IPC: C08G65/40 ,  H01L23/29 ,  H01L23/498 ,  H01L23/532 ,  C07C39/21

CPC classification number: C08G65/4006 ,  C08G2650/48 ,  C08G2650/60 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP0835275A1

公开(公告)日：1998-04-15

申请号：EP96922563.0

申请日：1996-06-25

Applicant: AlliedSignal Inc.

Inventor： LAU, Kreisler ,  HENDRICKS, Neil ,  WAN, William ,  SMITH, Aaron

IPC: C08G65 ,  H01L21 ,  H01L23

CPC classification number: H01L23/5329 ,  C08G65/4006 ,  C08G2650/48 ,  C08G2650/60 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/3154 ,  H01L2924/00

Abstract: A method is disclosed for making hydroxy-substituted ethynylated biphenyl compounds and for reacting such compounds with a family of noncross-linking thermosetting poly(arylene ethers) to produce novel poly(arylene ether) compositions which, when cured at glass transition temperatures greater than about 350 °C to form thin films, possess properties such as low dielectric constant, low moisture absorption, and high thermal stability. These films are suitable for use as intermetal dielectrics for multilevel interconnection.

Abstract translation: 公开了一种制备羟基取代的乙炔化联苯化合物和使这种化合物与非交联热固性聚（亚芳基醚）族反应以制备新型聚（亚芳基醚）组合物的方法，所述组合物在玻璃化转变温度大于约 350℃以形成薄膜，具有低介电常数，低吸湿性和高热稳定性等特性。 这些薄膜适合用作多层互连的金属间电介质。

公开(公告)号：EP0835274A1

公开(公告)日：1998-04-15

申请号：EP96921763.0

申请日：1996-06-25

Applicant: AlliedSignal Inc.

Inventor： LAU, Kreisler ,  HENDRICKS, Neil ,  WAN, William ,  SMITH, Aaron

IPC: C07D309 ,  B01J31 ,  C07B61 ,  C07C29 ,  C07C39 ,  C07C41 ,  C07C43 ,  C08G65 ,  H01L21 ,  H01L23

CPC classification number: C08G65/4006 ,  C08G2650/48 ,  C08G2650/60 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method is disclosed for making hydroxy-substituted ethynylated biphenyl compounds and for reacting such compounds with a family of noncross-linking thermosetting poly(arylene ethers) to produce novel poly(arylene ether) compositions which, when cured at glass transition temperatures greater than about 350 °C to form thin films, possess properties such as low dielectric constant, low moistures absorption, and high thermal stability. These films are suitable for use as intermetal dielectrics for multilevel interconnection.