公开(公告)号：CA2944958A1

公开(公告)日：2015-10-15

申请号：CA2944958

申请日：2015-04-10

Applicant: ALPHA METALS

Inventor： GHOSHAL SHAMIK ,  CHAKI NIRMALYA KUMAR ,  ROY POULAMI SENGUPTA ,  SARKAR SIULI ,  RUSTOGI ANUBHAV

IPC: B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F3/10 ,  B81B7/02 ,  H01L33/62 ,  H01L51/52

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 µm.

公开(公告)号：EP3154729A4

公开(公告)日：2018-02-28

申请号：EP15806611

申请日：2015-06-12

Applicant: ALPHA METALS

Inventor： GHOSHAL SHAMIK ,  KUMAR V SATHISH ,  VISHWANATH PAVAN ,  PANDHER RANJIT S ,  CHANDRAN REMYA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  BHATKAL RAVINDRA MOHAN

IPC: B22F1/02 ,  B22F3/10 ,  B22F5/00 ,  B22F7/02 ,  B22F7/04 ,  B23K35/02 ,  B23K35/30 ,  C22C1/04 ,  H01L23/00 ,  H05K1/09

CPC classification number: B22F1/0044 ,  B22F1/02 ,  B22F3/1017 ,  B22F3/22 ,  B22F5/006 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2999/00 ,  B23K1/0016 ,  B23K3/0607 ,  B23K35/0244 ,  B23K35/3006 ,  B23K2201/40 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68368 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/11003 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/11848 ,  H01L2224/13139 ,  H01L2224/13294 ,  H01L2224/13295 ,  H01L2224/13311 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13363 ,  H01L2224/1338 ,  H01L2224/13384 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13393 ,  H01L2224/13411 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13455 ,  H01L2224/13464 ,  H01L2224/13469 ,  H01L2224/1349 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/27009 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/27334 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/2782 ,  H01L2224/27821 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/75251 ,  H01L2224/75316 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83002 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0463 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/2064 ,  H05K3/32 ,  H05K2203/1131 ,  B22F1/0018 ,  B22F1/025 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01005 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.