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    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE
    1.
    发明申请
    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 审中-公开

    公开(公告)号：WO2021154813A1

    公开(公告)日：2021-08-05

    申请号：PCT/US2021/015221

    申请日：2021-01-27

    Applicant: AMPHENOL CORPORATION

    Inventor： DUNHAM, John, Robert ,  CARTIER, Marc, B., Jr. ,  GAILUS, Mark, W. ,  LEVINE, David ,  ASTBURY, Allan ,  SIVARAJAN, Vysakh ,  PROVENCHER, Daniel, B. ,  LEO, Eric

    IPC: H01R12/52 ,  H01R4/2456 ,  H01R13/6582

    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE
    2.
    发明申请
    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 审中-公开

    公开(公告)号：WO2021154823A1

    公开(公告)日：2021-08-05

    申请号：PCT/US2021/015234

    申请日：2021-01-27

    Applicant: AMPHENOL CORPORATION

    Inventor： CARTIER, Marc, B., Jr. ,  DUNHAM, John, Robert ,  GAILUS, Mark, W. ,  LEVINE, David ,  ASTBURY, Allan ,  SIVARAJAN, Vysakh ,  PROVENCHER, Daniel, B. ,  LEO, Eric

    IPC: H01R13/6582 ,  H01R12/52

    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

    HIGH SPEED ELECTRONIC SYSTEM WITH MIDBOARD CABLE CONNECTOR
    3.
    发明申请
    HIGH SPEED ELECTRONIC SYSTEM WITH MIDBOARD CABLE CONNECTOR 审中-公开

    公开(公告)号：WO2021055584A1

    公开(公告)日：2021-03-25

    申请号：PCT/US2020/051242

    申请日：2020-09-17

    Applicant: AMPHENOL CORPORATION

    Inventor： CARTIER, Marc, B., Jr. ,  GIRARD, Donald, A., Jr. ,  LEO, Eric

    IPC: H01R12/72 ,  H01R13/03 ,  H01R13/6581

    Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.

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