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    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE
    1.
    发明申请
    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 审中-公开

    公开(公告)号：WO2021154823A1

    公开(公告)日：2021-08-05

    申请号：PCT/US2021/015234

    申请日：2021-01-27

    Applicant: AMPHENOL CORPORATION

    Inventor： CARTIER, Marc, B., Jr. ,  DUNHAM, John, Robert ,  GAILUS, Mark, W. ,  LEVINE, David ,  ASTBURY, Allan ,  SIVARAJAN, Vysakh ,  PROVENCHER, Daniel, B. ,  LEO, Eric

    IPC: H01R13/6582 ,  H01R12/52

    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

    ELECTRICAL CONNECTORS
    2.
    发明申请
    ELECTRICAL CONNECTORS 审中-公开
    电气连接器

    公开(公告)号：WO2016168419A1

    公开(公告)日：2016-10-20

    申请号：PCT/US2016/027470

    申请日：2016-04-14

    Applicant: AMPHENOL CORPORATION

    Inventor： PITTEN, Tom ,  GAILUS, Mark, W. ,  CARTIER, Marc, B., Jr. ,  LEVINE, David ,  GIRARD, Donald, A., Jr.

    IPC: H01R12/52 ,  H01R13/24 ,  H01R25/00 ,  H01R13/05

    CPC classification number: H01R13/03 ,  H01R12/716 ,  H01R13/055 ,  H01R13/11 ,  H01R13/42 ,  H01R13/646 ,  H01R2107/00

    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.

    Abstract translation: 描述与包括超弹性部件的电连接器有关的实施例。 与常规连接器材料相比，超弹性材料的高弹性极限可以允许提供可靠连接和高频操作的设计。 超弹性组件还可以实现具有更高密度连接的连接器设计。 在一些实施例中，连接器包括形成连接器的配合触点的一个或多个超弹性细长构件。 超弹性细长构件在一个或多个导电插座内变形以产生合适的接触力。 导电插座可以包括多个突起，其布置成在配合期间偏转超弹性细长构件。 超弹性部件也可以设置在连接器的接收部分中，并且可以形成导电插座的一部分。

    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE
    3.
    发明申请
    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 审中-公开

    公开(公告)号：WO2021154813A1

    公开(公告)日：2021-08-05

    申请号：PCT/US2021/015221

    申请日：2021-01-27

    Applicant: AMPHENOL CORPORATION

    Inventor： DUNHAM, John, Robert ,  CARTIER, Marc, B., Jr. ,  GAILUS, Mark, W. ,  LEVINE, David ,  ASTBURY, Allan ,  SIVARAJAN, Vysakh ,  PROVENCHER, Daniel, B. ,  LEO, Eric

    IPC: H01R12/52 ,  H01R4/2456 ,  H01R13/6582

    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

    INSULATIVE SUPPORT FOR VERY HIGH SPEED ELECTRICAL INTERCONNECTION
    4.
    发明申请
    INSULATIVE SUPPORT FOR VERY HIGH SPEED ELECTRICAL INTERCONNECTION 审中-公开

    公开(公告)号：WO2019183065A1

    公开(公告)日：2019-09-26

    申请号：PCT/US2019/022934

    申请日：2019-03-19

    Applicant: AMPHENOL CORPORATION

    Inventor： CARTIER, Marc, B., Jr. ,  DUNHAM, John, Robert ,  SIVARAJAN, Vysakh ,  GAILUS, Mark, W. ,  LEVINE, David ,  SNYDER, Michael, Joseph

    IPC: H01R12/71 ,  H01R13/6585

    Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.

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