公开(公告)号：KR20200126436A

公开(公告)日：2020-11-06

申请号：KR20207031321

申请日：2013-05-28

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: 전자디바이스하우징의다양한컴포넌트들및 그것들의조립을위한방법이개시된다. 하우징은둘 이상의상이한섹션들을서로조립하고연결함으로써형성될수 있다. 하우징의섹션들은하나이상의결합부재를이용하여서로결합될수 있다. 결합부재들은제1 샷이결합부재들의구조적부분을형성하고, 제2 샷이결합부재들의장식용부분들을형성하는 2 샷몰딩프로세스를사용하여형성될수 있다.

公开(公告)号：AU2020200881A1

公开(公告)日：2020-02-27

申请号：AU2020200881

申请日：2020-02-07

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：HK1245360A1

公开(公告)日：2018-08-24

申请号：HK18104693

申请日：2018-04-10

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  RUSSELL-CLARKE PETER N ,  BROWNING LUCY E ,  HANCHAK-CONNORS JULIE ,  THORNTON III JOHN M ,  JOHANNESSEN THOMAS ,  TATEBE MASASHIGE ,  HOWARTH RICHARD ,  JENSEN PEGGY ,  POLLEY JOHN ,  CHOINIERE PAUL ,  COLEMAN MICHAEL ,  PILLIOD MICHAEL K ,  TAN NAPTHANEAL Y

IPC: C25D20060101

公开(公告)号：AU2018203006A1

公开(公告)日：2018-05-17

申请号：AU2018203006

申请日：2018-05-01

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：AU2016201649B2

公开(公告)日：2018-02-01

申请号：AU2016201649

申请日：2016-03-15

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one 5 or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：AU2013267596A1

公开(公告)日：2015-01-22

申请号：AU2013267596

申请日：2013-05-28

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：AU2020200881B2

公开(公告)日：2020-03-05

申请号：AU2020200881

申请日：2020-02-07

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：AU2018203006B2

公开(公告)日：2019-11-07

申请号：AU2018203006

申请日：2018-05-01

Applicant: APPLE INC

Inventor： JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P ,  WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N

IPC: H04B1/38

Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：AU2016201649A1

公开(公告)日：2016-04-07

申请号：AU2016201649

申请日：2016-03-15

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one 5 or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：AU2013267596B2

公开(公告)日：2015-12-17

申请号：AU2013267596

申请日：2013-05-28

Applicant: APPLE INC

Inventor： WOODHULL CHARLES B ,  KIPLE BRYAN P ,  PAKULA DAVID A ,  TAN TANG Y ,  HELEY RICHARD W ,  WEBER DOUGLAS J ,  PREST CHRISTOPHER D ,  MEMERING DALE N ,  JOHANNESSEN THOMAS ,  COLEMAN MICHAEL P

IPC: H04B1/38

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.