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公开(公告)号:KR20180055932A
公开(公告)日:2018-05-25
申请号:KR20187013965
申请日:2015-08-25
Applicant: APPLE INC
Inventor: DE JONG ERIK G , MEMERING DALE N , MYLVAGANAM JEFFREY C
Abstract: 신호전송시스템을포함하는전자디바이스. 전자디바이스는하우징, 및하우징에결합되고커버에형성된홈을정의하는커버를포함할수 있다. 전자디바이스는하우징내에위치설정된신호전송시스템을또한포함할수 있다. 신호전송시스템은커버내에형성된홈 내에적어도부분적으로수용된안테나를포함할수 있다. 안테나는안테나본체, 및안테나본체와전기적으로통하는접촉패드를가질수 있다. 신호전송시스템은안테나본체에인접하게위치설정된가요성부재를또한가질수 있다. 가요성부재는안테나의접촉패드와접촉할수 있다.
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公开(公告)号:KR20200126436A
公开(公告)日:2020-11-06
申请号:KR20207031321
申请日:2013-05-28
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: 전자디바이스하우징의다양한컴포넌트들및 그것들의조립을위한방법이개시된다. 하우징은둘 이상의상이한섹션들을서로조립하고연결함으로써형성될수 있다. 하우징의섹션들은하나이상의결합부재를이용하여서로결합될수 있다. 결합부재들은제1 샷이결합부재들의구조적부분을형성하고, 제2 샷이결합부재들의장식용부분들을형성하는 2 샷몰딩프로세스를사용하여형성될수 있다.
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公开(公告)号:AU2020200881A1
公开(公告)日:2020-02-27
申请号:AU2020200881
申请日:2020-02-07
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2014323434A1
公开(公告)日:2016-02-11
申请号:AU2014323434
申请日:2014-09-19
Applicant: APPLE INC
Inventor: MEMERING DALE N , DE JONG ERIK G , ROTHKOPF FLETCHER R , WEISS SAMUEL BRUCE
Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.
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公开(公告)号:AU2014323434B2
公开(公告)日:2017-07-13
申请号:AU2014323434
申请日:2014-09-19
Applicant: APPLE INC
Inventor: MEMERING DALE N , DE JONG ERIK G , ROTHKOPF FLETCHER R , WEISS SAMUEL BRUCE
Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.
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公开(公告)号:DE112015000587T5
公开(公告)日:2016-11-03
申请号:DE112015000587
申请日:2015-01-28
Applicant: APPLE INC
Inventor: LI MICHAEL M , MEMERING DALE N , RICHTER ANTHONY J
Abstract: Ein System und ein Verfahren zum Herstellen eines Saphirteils. Ein Saphirsubstrat 300 wird zum Durchführen einer Laserschneidoperation erhalten. Das Saphirsubstrat wird unter Verwendung eines Lasers 402 und eines ersten Gasmediums, das durch eine Gaszufuhrvorrichtung 404 zugeführt wird, entlang eines Schnittprofils 302 geschnitten. Das erste Gasmedium ist im Wesentlichen aus einem Inertgas zusammengesetzt. Das Saphirsubstrat wird dann an oder nahe dem Schnittprofil unter Verwendung eines Lasers und eines zweiten Gasmediums bestrahlt. Das zweite Gasmedium unterscheidet sich von dem ersten Gasmedium, das Sauerstoff umfasst.
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公开(公告)号:AU2018203006A1
公开(公告)日:2018-05-17
申请号:AU2018203006
申请日:2018-05-01
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2016201649B2
公开(公告)日:2018-02-01
申请号:AU2016201649
申请日:2016-03-15
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one 5 or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2013267596A1
公开(公告)日:2015-01-22
申请号:AU2013267596
申请日:2013-05-28
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2020200881B2
公开(公告)日:2020-03-05
申请号:AU2020200881
申请日:2020-02-07
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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