전자 디바이스를 위한 신호 전송 시스템

    公开(公告)号:KR20180055932A

    公开(公告)日:2018-05-25

    申请号:KR20187013965

    申请日:2015-08-25

    Applicant: APPLE INC

    CPC classification number: H01Q1/243 H01Q1/273 H01Q7/00

    Abstract: 신호전송시스템을포함하는전자디바이스. 전자디바이스는하우징, 및하우징에결합되고커버에형성된홈을정의하는커버를포함할수 있다. 전자디바이스는하우징내에위치설정된신호전송시스템을또한포함할수 있다. 신호전송시스템은커버내에형성된홈 내에적어도부분적으로수용된안테나를포함할수 있다. 안테나는안테나본체, 및안테나본체와전기적으로통하는접촉패드를가질수 있다. 신호전송시스템은안테나본체에인접하게위치설정된가요성부재를또한가질수 있다. 가요성부재는안테나의접촉패드와접촉할수 있다.

    Electronic component embedded in ceramic material

    公开(公告)号:AU2014323434A1

    公开(公告)日:2016-02-11

    申请号:AU2014323434

    申请日:2014-09-19

    Applicant: APPLE INC

    Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.

    Electronic component embedded in ceramic material

    公开(公告)号:AU2014323434B2

    公开(公告)日:2017-07-13

    申请号:AU2014323434

    申请日:2014-09-19

    Applicant: APPLE INC

    Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.

    System und Verfahren zum Laserschneiden von Saphir unter Verwendung mehrerer Gasmedien

    公开(公告)号:DE112015000587T5

    公开(公告)日:2016-11-03

    申请号:DE112015000587

    申请日:2015-01-28

    Applicant: APPLE INC

    Abstract: Ein System und ein Verfahren zum Herstellen eines Saphirteils. Ein Saphirsubstrat 300 wird zum Durchführen einer Laserschneidoperation erhalten. Das Saphirsubstrat wird unter Verwendung eines Lasers 402 und eines ersten Gasmediums, das durch eine Gaszufuhrvorrichtung 404 zugeführt wird, entlang eines Schnittprofils 302 geschnitten. Das erste Gasmedium ist im Wesentlichen aus einem Inertgas zusammengesetzt. Das Saphirsubstrat wird dann an oder nahe dem Schnittprofil unter Verwendung eines Lasers und eines zweiten Gasmediums bestrahlt. Das zweite Gasmedium unterscheidet sich von dem ersten Gasmedium, das Sauerstoff umfasst.

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