-
公开(公告)号:GB2469386A
公开(公告)日:2010-10-13
申请号:GB201005780
申请日:2010-04-07
Applicant: APPLE INC
Inventor: HONG SEUNG JAE , GRUNTHANER MARTIN PAUL , HOTELLING STEVEN PORTER , YOUNGS LYNN
IPC: G06F3/044
Abstract: A touch sensor panel including a plurality of drive lines crossing a plurality of sense lines, forming an array. The plurality of drive lines and the plurality of sense lines are formed by interconnecting sections of at least one conductive material which may have a truncated diamond shape or formed of interconnected conductive lines. At least one conductive dummy region may be disposed in an area of the touch sensor panel around the truncated diamond shape sections or interconnected conductive lines of the plurality of drive lines and the plurality of sense lines. One or more lines may be formed overlapping the interconnected sections of each of the plurality of drive lines and the plurality of sense lines. The insulator may be opaque, with a mask layered over the interconnects. The system may be used in a touch screen computer display.
-
公开(公告)号:GB2469386B
公开(公告)日:2011-09-28
申请号:GB201005780
申请日:2010-04-07
Applicant: APPLE INC
Inventor: HONG SEUNG JAE , GRUNTHANER MARTIN PAUL , HOTELLING STEVEN PORTER , YOUNGS LYNN
IPC: G06F3/044
-
公开(公告)号:WO2010117882A3
公开(公告)日:2011-03-03
申请号:PCT/US2010029698
申请日:2010-04-01
Applicant: APPLE INC , HONG SUENG JAE , GRUNTHANER MARTIN PAUL , HOTELLING STEVEN PORTER , YOUNGS LYNN
Inventor: HONG SUENG JAE , GRUNTHANER MARTIN PAUL , HOTELLING STEVEN PORTER , YOUNGS LYNN
IPC: G06F3/044
CPC classification number: G06F3/044 , G06F2203/04111 , G06F2203/04112
Abstract: A touch sensor panel including a plurality of drive lines crossing a plurality of sense lines, forming an array. The plurality of drive lines and the plurality of sense lines are formed by interconnecting sections of at least one conductive material having a truncated diamond shape or formed of interconnected conductive lines. At least one conductive dummy region may be disposed in an area of the touch sensor panel around the truncated diamond shape sections or interconnected conductive lines of the plurality of drive lines and the plurality of sense lines. One or more lines may be formed overlapping the interconnected sections of each of the plurality of drive lines and the plurality of sense lines.
Abstract translation: 一种触摸传感器面板,包括与多根感测线交叉的多条驱动线,形成阵列。 多个驱动线和多条感测线通过互连具有截头菱形形状或由互连导电线形成的至少一种导电材料的部分而形成。 至少一个导电虚拟区域可以设置在触摸传感器面板周围围绕多个驱动线和多条感测线的截短的菱形形状部分或互连导电线的区域中。 可以形成与多个驱动线和多个感测线中的每一条的互连部分重叠的一条或多条线。
-
公开(公告)号:WO2010080988A3
公开(公告)日:2010-09-10
申请号:PCT/US2010020485
申请日:2010-01-08
Applicant: APPLE INC , CHANG SHIH CHANG , ZHONG JOHN Z , HUANG LILI , HONG SEUNG JAE , YOUNGS LYNN
Inventor: CHANG SHIH CHANG , ZHONG JOHN Z , HUANG LILI , HONG SEUNG JAE , YOUNGS LYNN
CPC classification number: G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
Abstract: A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
Abstract translation: 一种制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。 在一个实施例中,形成两个薄玻璃片的夹层,使得当在制造期间在夹层的表面上执行薄膜工艺时,玻璃片的组合厚度不会降低到现有制造设备的最小厚度公差之下。 三明治可能最终会分开形成两个薄的SITO / DITO面板。 在另一个实施例中,制造工艺涉及层压两个图案化的厚基底,每个基底至少具有现有制造设备的最小厚度公差。 然后,薄片化一个或两个层压衬底的侧面,从而当衬底分离时,每个都是厚度小于现有制造设备的最小厚度公差的薄DITO / SITO面板。
-
-
-