公开(公告)号：WO2022108776A1

公开(公告)日：2022-05-27

申请号：PCT/US2021/058397

申请日：2021-11-08

Applicant: APPLE INC.

Inventor： SHANMUGAM, Karthik ,  CARSON, Flynn P. ,  ZHAI, Jun ,  CAMENFORTE, Raymundo M. ,  LI, Menglu

IPC: H01L23/538 ,  H01L21/683 ,  H01L23/00

Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.