公开(公告)号：WO2014051924A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/057174

申请日：2013-08-28

Applicant: APPLE INC.

Inventor： MATHEW, Dinesh C. ,  COOPER, Edward J. ,  DEGNER, Brett W. ,  HENDREN, Keith J. ,  RUNDLE, Nicholas Alan ,  TARKINGTON, David P.

IPC: G02F1/1333 ,  G02F1/13 ,  G02F1/13357

CPC classification number: G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133331 ,  G02F2202/28

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a backlight assembly to a cover glass layer while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to the backlight assembly. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In another embodiment, a series of rigid plates can be bonded to the cover glass layer and attached to the backlight assembly. Point loads applied from the backlight assembly can be distributed over a larger area due to the resilience of the rigid plates.

Abstract translation: 所描述的实施例一般涉及包括液晶显示器（LCD）的计算设备，更具体地涉及用于将背光组件附着到覆盖玻璃层的方法，同时使通过盖玻璃层传递到LCD模块的应力的量最小化。 可以使用连续且顺从的泡沫粘合剂将覆盖玻璃层粘合到背光组件。 柔性粘合剂可以吸收和分布由各种结构和覆盖玻璃层之间的结构载荷，不匹配表面和不同热膨胀率引起的局部应力集中。 这可以降低玻璃层中的应力集中，从而导致液晶显示单元中的应力引起的双折射。 在另一个实施例中，一系列刚性板可以结合到覆盖玻璃层并附着到背光组件上。 由于刚性板的弹性，从背光组件施加的点载荷可以分布在更大的面积上。

公开(公告)号：EP3151342A3

公开(公告)日：2017-08-09

申请号：EP16183823.0

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： TALALAYEV, Anton ,  NARAJOWSKI, David H. ,  LIGTENBERG, Christiaan A. ,  AMINI, Mahmoud R. ,  LEGGETT, William F. ,  SILVANTO, Mikael M. ,  STRINGER, Christopher J. ,  TZIVISKOS, George ,  COOPER, Edward J. ,  HOPKINSON, Ron Alan ,  MILLER, Ari Parsons

IPC: H01R12/73 ,  H01R24/62 ,  H01R13/6582 ,  H01R13/6594 ,  H01R13/66 ,  H01R25/00 ,  H01R12/71

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.

Abstract translation: 描述了互连设备。 在一些示例中，互连装置可以在第一平面中对齐并且可以包括具有舌部分和销部分的印刷电路板。 销部分可以包括远离印刷电路板延伸的多个销。 互连装置可以被配置为与在第二平面中对齐的主逻辑板电耦合。 特别地，多个引脚可以插入主逻辑板内的相应电接触位置以形成双平面连接。 双平面连接可以以最小化高速数据传输的信号损失的方式进行。

公开(公告)号：EP3151342B1

公开(公告)日：2019-01-23

申请号：EP16183823.0

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： TALALAYEV, Anton ,  NARAJOWSKI, David H. ,  LIGTENBERG, Christiaan A. ,  AMINI, Mahmoud R. ,  LEGGETT, William F. ,  SILVANTO, Mikael M. ,  STRINGER, Christopher J. ,  TZIVISKOS, George ,  COOPER, Edward J. ,  HOPKINSON, Ron Alan ,  MILLER, Ari Parsons

IPC: H01R12/73 ,  H01R24/62 ,  H01R13/6582 ,  H01R13/6594 ,  H01R13/66 ,  H01R25/00 ,  H01R12/71

公开(公告)号：EP3151342A2

公开(公告)日：2017-04-05

申请号：EP16183823.0

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： TALALAYEV, Anton ,  NARAJOWSKI, David H. ,  LIGTENBERG, Christiaan A. ,  AMINI, Mahmoud R. ,  LEGGETT, William F. ,  SILVANTO, Mikael M. ,  STRINGER, Christopher J. ,  TZIVISKOS, George ,  COOPER, Edward J.

IPC: H01R12/73 ,  H01R24/62 ,  H01R13/6582 ,  H01R13/6594

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.

Abstract translation: 描述了互连设备。 在一些示例中，互连装置可以在第一平面中对准并且可以包括具有舌部和针部分的印刷电路板。 销部分可以包括远离印刷电路板延伸的多个销。 互连装置可以被配置为与在第二平面中对准的主逻辑板电耦合。 特别地，多个引脚可以插入到主逻辑板内的对应的电接触位置中以形成双平面连接。 双平面连接可以以最小化高速数据传输的信号损失的方式进行。