中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.022 seconds)

    DEVICE ENCLOSURE
    1.
    发明申请
    DEVICE ENCLOSURE 审中-公开

    公开(公告)号：WO2020131262A1

    公开(公告)日：2020-06-25

    申请号：PCT/US2019/061734

    申请日：2019-11-15

    Applicant: APPLE INC.

    Inventor： HOOTON, Lee E. ,  WITTENBERG, Michael B. ,  MESCHKE, Andrew J. ,  WILLIAMS, Alexander W.

    IPC: B23P13/02 ,  B23Q3/08 ,  G06F1/16 ,  H05K7/00

    Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

    THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE
    2.
    发明申请
    THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE 审中-公开
    电子设备中的热分布组件

    公开(公告)号：WO2018057651A1

    公开(公告)日：2018-03-29

    申请号：PCT/US2017/052562

    申请日：2017-09-20

    Applicant: APPLE INC.

    Inventor： JARVIS, Daniel W. ,  PAKULA, David A. ,  DUNSMOOR, David J. ,  SPRAGGS, Ian A. ,  HOOTON, Lee E. ,  RAMMAH, Marwan ,  HILL, Matthew D. ,  MEYER, Robert F. ,  BERTIN, James A. ,  HELMORE, Simon C. ,  WAH, Melissa A. ,  HOUSOUR, Jon F. ,  FOURNIER, Douglas G. ,  TOMASETTA, Christopher S. ,  BENNETT, Eric M.

    IPC: H05K7/20 ,  H05K5/00 ,  H04M1/02

    Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.

    Abstract translation: 公开了一种用于电子设备的热分配组件。 该电子设备包括由金属带和由玻璃，蓝宝石或塑料形成的非金属底壁限定的外壳。 在这方面，外壳可以包括相对低的导热率。 然而，热分配组件提供了热传递能力，其通过使用非金属底壁来抵消导热损失，并且还提供了额外的结构支撑。 热分配组件可以包括第一层，第二层和第三层。 第一和第三层提供结构支撑，而第二层提供相对高的导热层。 热分配组件包括接合并热耦合到金属带的侧壁，允许热分配组件从发热部件吸取热量，并将热量传递到金属带，同时最小化或防止温度沿着非金属底部增加 壁。

    ELECTRONIC DEVICES WITH DISPLAYS AND CAMERA WINDOWS
    3.
    发明公开
    ELECTRONIC DEVICES WITH DISPLAYS AND CAMERA WINDOWS 审中-实审

    公开(公告)号：EP4340339A1

    公开(公告)日：2024-03-20

    申请号：EP23194989.2

    申请日：2023-09-01

    Applicant: Apple Inc.

    Inventor： HOOTON, Lee E. ,  LIU, Jia ,  CHOINIERE, Paul ,  JARVIS, Daniel W.

    IPC: H04M1/02

    Abstract: Electronic devices (10) may be provided with components such as displays (14) and cameras. A display (14) may be mounted in a housing (12). The housing (12) may have a sidewall (12W). A bent portion of the display (14) may be embedded in epoxy (20) that is separated from the sidewall (12W) by an air gap (22). Adhesive (24) may attach the epoxy to the housing. A metal support (26) that is chemically bonded to the epoxy (20) may be welded to metal structures such as camera brackets and other metal supports. The housing (12) may have a glass layer that forms a rear wall (12R). The glass layer may have a protruding portion (12RP) that forms a glass plateau with openings through which cameras operate. A camera (54) may have a protruding portion that is received within one of the glass plateau openings. The protruding portion (12RP) may extend into a metal camera trim (52) in one of the openings that is attached to the glass plateau.

Patent Agency Ranking