THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE
    1.
    发明申请
    THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE 审中-公开
    电子设备中的热分布组件

    公开(公告)号:WO2018057651A1

    公开(公告)日:2018-03-29

    申请号:PCT/US2017/052562

    申请日:2017-09-20

    Applicant: APPLE INC.

    Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.

    Abstract translation: 公开了一种用于电子设备的热分配组件。 该电子设备包括由金属带和由玻璃,蓝宝石或塑料形成的非金属底壁限定的外壳。 在这方面,外壳可以包括相对低的导热率。 然而,热分配组件提供了热传递能力,其通过使用非金属底壁来抵消导热损失,并且还提供了额外的结构支撑。 热分配组件可以包括第一层,第二层和第三层。 第一和第三层提供结构支撑,而第二层提供相对高的导热层。 热分配组件包括接合并热耦合到金属带的侧壁,允许热分配组件从发热部件吸取热量,并将热量传递到金属带,同时最小化或防止温度沿着非金属底部增加 壁。

Patent Agency Ranking